TSOP-50 Related Product
Part Number | Description | Brand | Lifecycle Status | Cargo cycle | In Stock | Operation |
---|---|---|---|---|---|---|
IS42S16400F-7TL | 4M X 16 Synchronous DRAM | ISSI | Discontinued | 3~7 Days | 5,324 | |
IS42S16100E-7TLI | Package type: TSOP | Issi, Integrated Silicon Solution Inc | 3~7 Days | 5,565 | ||
IS42S16400F-6TL | Boasting a generous storage capacity of 64 megabytes | ISSI | 3~7 Days | 5,869 | ||
HY57V161610DTC-7 | Synchronous DRAM module with 1MX16 capacity, operating at 6ns speed, utilizing CMOS technology in a PDSO50 package measuring 0 | SAMSUNG | 3~7 Days | 4,122 | ||
HY57V161610ETP-7 | Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 X 0.825 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-50 | HYNIX | 3~7 Days | 4,066 | ||
K4S161622E-TC60 | French Electronic Distributor since 1988 | SAMSUNG | 3~7 Days | 7,946 | ||
W9816G6CH-7 | Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, ROHS COMPLIANT, TSOP2-50 | WINBOND | 3~7 Days | 3,404 | ||
HY57V161610DTC-8 | Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 X 0.825 INCH, 0.80 MM PITCH, TSOP2-50 | HYNIX | 3~7 Days | 4,443 | ||
W9816G6JH-5 TR | IC DRAM 16MBIT PAR 50TSOP II | Winbond Electronics | NRND | 3~7 Days | 8,827 | |
IS45S16100H-7TLA2-TR | 3.3V voltage requirement | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 5,779 | |
IS45S16100H-7TLA1-TR | TSOPII-50 SDRAM IS45S16100H-7TLA1-TR (ROHS) | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 6,837 | |
W9816G6JH-7 TR | Enhanced performance and power efficiency for data-intensive tas | Winbond | 3~7 Days | 7,723 | ||
W9816G6JH-6I TR | High-quality Mb SDR SDRAM for improved system performance | Winbond | 3~7 Days | 5,076 | ||
W9816G6JH-6 TR | Reliable and efficient SDRAM module for demanding applications | Winbond | 3~7 Days | 5,162 | ||
IS42S16100H-6TL-TR | DRAM Chip SDR SDRAM | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 5,967 | |
W9816G6JH-6I | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II | Winbond Electronics | NRND | 3~7 Days | 6,409 | |
MD51V65165E-50TAZ0AR | 64Mbit RAM chip with parallel interface and 50TSOP II package | Rohm Semiconductor | OBSOLETE | 3~7 Days | 6,374 | |
K4S161622D-TC80 | TSOP package ensures compact design and easy integration into PCB | Samsung Semiconductor | 3~7 Days | 4,041 | ||
W9816G6JH-6 | 16Mbit SDRAM DRAM Chip with 1Mx16 Configuration and 3.3V Voltage | Winbond Electronics | NRND | 3~7 Days | 8,489 | |
IS42S16100H-7TLI | High-speed 16M memory module | ISSI | Active | 3~7 Days | 6,416 | |
IS45S16100H-7TLA2 | High-performance SDRAM module designed for reliability and efficiency | Issi | 3~7 Days | 7,882 | ||
AS4C1M16S-7TCN | This 50-pin TSOP-II packaged chip offers efficient memory storage and retrieval capabilities | Alliance Memory | 3~7 Days | 4,105 | ||
IS42S16100H-7TLI-TR | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II T/R | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 6,504 | |
IS42S16100E-7TL | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II | ISSI, Integrated Silicon Solution Inc | OBSOLETE | 3~7 Days | 9,464 | |
W9816G6JH-7I | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II | Winbond Electronics | NRND | 3~7 Days | 8,560 | |
IS45S16100H-7TLA1 | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V Automotive AEC-Q100 50-Pin TSOP-II | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 6,689 | |
IS42S16100H-6TLI-TR | DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II T/R | ISSI, Integrated Silicon Solution Inc | ACTIVE | 3~7 Days | 5,927 |
Additional Package/Case