BCM20732S

Effective Inventory7,431

RF System on a Chip - SoC

  • Manufacturer Part # : BCM20732S

  • Package/Case: LGA-48

  • Part Status : OBSOLETE

  • Brand: Cypress Semiconductor Corp

  • RoHS:

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Cut Tape

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BCM20732S DataSheet

Pricing (USD)

Quantity Unit Price Ext. Price
1 $9.379 $9.38
260 $3.631 $944.06
520 $3.504 $1,822.08
1040 $3.439 $3,576.56

These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.

Rapid Quote

Please submit RFQ for BCM20732S or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The BCM20732S is a single-chip Bluetooth Smart system-on-chip (SoC) solution from Broadcom. It is designed for low-power, high-performance applications in the Internet of Things (IoT) and wearable technology markets. The chip features an ARM Cortex-M3 processor running at 16MHz, and integrates Bluetooth Smart radio, baseband, and protocol stack functionalities in a single package.The BCM20732S supports Bluetooth Low Energy (BLE) technology, which allows for low-power wireless communication with a range of devices such as smartphones, tablets, and sensors. It also features an integrated antenna, which simplifies the design of devices and lowers overall costs.In terms of connectivity, the chip supports Bluetooth Smart profiles such as the Generic Attribute Profile (GATT) and Generic Access Profile (GAP), making it easy to connect to a wide range of devices and services. It also supports over-the-air firmware upgrades, allowing for easy maintenance and updates to devices.

Key Features

  • This chip is suitable for wearables and other small devices
  • requiring a long battery life and minimal power consumption
  • while still providing reliable BLE connectivity

Application

  • Wearable devices
  • Health and fitness monitors
  • Smart watches
  • Smart home devices
  • Bluetooth-enabled headphones
  • Automotive applications
  • Industrial IoT applications
  • Consumer electronics
  • Wireless sensors
  • Multifunctional remote controls

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Product Category ! RF System on a Chip - SoC RoHS Details
Type Bluetooth, BLE, LR-WPAN Core ARM Cortex M3
Operating Frequency ! 24 MHz Supply Voltage - Min 1.4 V
Supply Voltage - Max 3.6 V Minimum Operating Temperature - 30 C
Maximum Operating Temperature ! + 85 C Package / Case LGA-48
ADC Resolution 10 bit, 13 bit Brand Infineon Technologies
Data Bus Width 32 bit Data RAM Size 60 kB
Data RAM Type RAM Height 1.2 mm
Interface Type I2C, SPI, UART Length 6.5 mm
Maximum Clock Frequency 24 MHz Moisture Sensitive Yes
Mounting Style SMD/SMT Number of I/Os 14 I/O
Number of Timers 4 Product Type ! RF System on a Chip - SoC
Series CYW20732 Factory Pack Quantity 260
Subcategory Wireless & RF Integrated Circuits Technology Si
Width 6.5 mm

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