BGA2012

Effective Inventory5,901

A high-performing low noise amplifier specifically engineered for 1900 MHz signals

  • Manufacturer Part # : BGA2012

  • Package/Case: SOT363

  • Brand: PHILIPS

  • Product Categories : Instrumentation, OP Amps, Buffer Amps

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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WireTransfer

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Paypal

cc

CreditCard

western

WesternUnion

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MoneyGram

Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

BGA2012 DataSheet

no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for BGA2012 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

BGA2012 is a business networking event that brings together industry professionals, entrepreneurs, and innovators to connect, collaborate, and exchange ideas. The event features keynote speeches from industry leaders, panel discussions on current business trends, workshops on professional development, and networking opportunities to build relationships and partnerships.Participants can expect to gain valuable insights, knowledge, and connections that can help further their careers and businesses. The event covers a wide range of topics, including marketing, finance, technology, and leadership.BGA2012 also offers exhibitor booths for companies to showcase their products and services, as well as networking sessions where attendees can meet potential partners and investors. The event is designed to inspire and empower individuals to take their businesses to the next level and stay ahead in a competitive market.

Key Features

  • BGA2012 features a 0
  • 8 mm pitch, 0
  • 5 mm pad size, and a maximum package height of 0
  • 58 mm
  • It is designed for compact, high-density applications, offers reliable solder joints, and improved thermal performance
  • The package is available in various configurations to suit different assembly requirements
  • Application

  • The BGA2012 is commonly used in mobile devices, such as smartphones and tablets, for power amplification in wireless communication systems
  • It is also utilized in automotive applications for radar and communications systems
  • Other application areas include industrial and consumer electronics for various wireless connectivity applications
  • Specifications

    The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

    salesNum BGA2012,115 pack_type REEL
    pack_desc Reel 7" Q1/T1 minPackQty 3000
    status No Longer Manufactured

    Datasheet PDF

    Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

    Preliminary Specification BGA2012 PDF Download

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