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CXP82612
CXP82612 is a low-power, high-performance microcontroller chip by Sony for use in IoT devices.
CXP82612
CXP82612 is a low-power, high-performance microcontroller chip by Sony for use in IoT devices.
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Shipping & Payment
Shipping & Payment
About Shipping
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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CXP82612 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
CXP82612 is a high-performance, low-power Ethernet transceiver chip designed for use in various networking applications. It features 12.5Gbps data rate and supports 1000BASE-X and 10GBASE-KR interfaces. The chip is compliant with IEEE 802.3 standards and is commonly used in data centers, enterprise networks, and telecommunications systems.One of the key features of CXP82612 is its low power consumption, making it an energy-efficient solution for networking equipment. It also supports auto-negotiation and auto-MDIX, allowing for easy integration into existing network setups. The chip is built with advanced signal processing technologies to ensure reliable data transmission and high bandwidth performance.CXP82612 is designed to be compatible with a wide range of optical modules, making it a versatile solution for various network configurations. It also includes advanced error correction and detection capabilities to ensure data integrity and reliability.
Key Features
- Highly integrated CMOS image sensor interface
- Up to 12 lanes of RX and TX
- Supports 10Gbps per lane
- Low power consumption
- Flexible and programmable interface
- Real-time equalization and clock data recovery
Application
- Industrial automation
- Robotics
- Machine vision systems
- High-speed cameras
- Medical imaging devices
- Traffic monitoring systems
- Surveillance cameras
- Security systems
- Automated inspection systems
- Printing and packaging machines
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Active | Part Package Code | QFP |
| Pin Count ! | 80 | Reach Compliance Code | |
| HTS Code ! | 8542.31.00.01 | Has ADC | YES |
| Address Bus Width ! | Bit Size | 8 | |
| Clock Frequency-Max | 10 MHz | DAC Channels | NO |
| DMA Channels | NO | External Data Bus Width | |
| JESD-30 Code | R-PQFP-G80 | JESD-609 Code | e6/e4 |
| Length | 20 mm | Number of I/O Lines | 52 |
| Number of Terminals | 80 | Operating Temperature-Max | 75 °C |
| Operating Temperature-Min | -20 °C | PWM Channels | NO |
| Package Body Material | PLASTIC/EPOXY | Package Code | QFP |
| Package Shape | RECTANGULAR | Package Style | FLATPACK |
| Peak Reflow Temperature (Cel) | 260 | Qualification Status ! | Not Qualified |
| ROM Programmability | MROM | Speed | 10 MHz |
| Supply Voltage-Max | 5.5 V | Supply Voltage-Min | 4.5 V |
| Supply Voltage-Nom | 5 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | COMMERCIAL EXTENDED |
| Terminal Finish | TIN BISMUTH/PALLADIUM | Terminal Form ! | GULL WING |
| Terminal Pitch ! | 0.8 mm | Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 10 | Width | 14 mm |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
