EP2C70F896C6

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The EP2C70F896C6 is a versatile programmable logic device for a range of applications"

  • Manufacturer Part # : EP2C70F896C6

  • Package/Case: 896-BGA

  • Part Status : ACTIVE

  • Brand: Intel

  • Product Categories : FPGAs (Field Programmable Gate Array)

Quality Assurance

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

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About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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EP2C70F896C6 DataSheet

Pricing (USD)

Quantity Unit Price Ext. Price
1 $2,302.362 $2,302.36
189 $918.659 $173,626.55
513 $887.960 $455,523.48
999 $872.791 $871,918.21

These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.

Rapid Quote

Please submit RFQ for EP2C70F896C6 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

Power up your design with the EP2C70F896C6, a member of Intel's Cyclone II FPGA family. With 69,120 logic elements, 3.9 Mbits of RAM, and 288 embedded multipliers, this FPGA is well-suited for applications in telecommunications, industrial automation, and image processing. Its 896-pin fine-line ball grid array (FBGA) package type ensures secure integration into various systems, while its support for I/O standards like LVDS and SSTL enhances its versatility for interfacing with external devices. The EP2C70F896C6's low power consumption makes it an excellent choice for battery-powered or energy-efficient designs, and its on-chip configuration storage simplifies system integration. Additionally, with a maximum operating frequency of 300 MHz, this FPGA offers substantial processing power to meet the demands of your application. Choose the EP2C70F896C6 for your next project and experience its impressive capabilities in action

Key Features

  • High-density architecture with 4,608 to 68,416 LEs
  • M4K embedded memory blocks
  • Up to 1.1 Mbits of RAM available without reducing available logic
  • 4,096 memory bits per block (4,608 bits per block including 512 parity bits)
  • Variable port configurations of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36
  • True dual-port (one read and one write, two reads, or two writes) operation for ×1, ×2, ×4, ×8, ×9, ×16, and ×18 modes
  • Byte enables for data input masking during writes
  • Up to 260-MHz operation
  • Embedded multipliers
  • Up to 150 18- × 18-bit multipliers are each configurable as two independent 9- × 9-bit multipliers with up to 250-MHz performance
  • Optional input and output registers
  • Advanced I/O support
  • High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL
  • Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL
  • Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces
  • PCI Express with an external TI PHY and an Altera PCI Express ×1 Megacore® function
  • 133-MHz PCI-X 1.0 specification compatibility
  • High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use
  • Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register
  • Programmable bus-hold feature
  • Programmable output drive strength feature
  • Programmable delays from the pin to the IOE or logic array
  • I/O bank grouping for unique VCCIO and/or VREF bank settings
  • MultiVolt™ I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces
  • Hot-socketing operation support
  • Tri-state with weak pull-up on I/O pins before and during configuration
  • Programmable open-drain outputs
  • Series on-chip termination support
  • (Continue ...)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Series Cyclone® II Package Tray
Product Status Active Programmable Not Verified
Number of LABs/CLBs 4276 Number of Logic Elements/Cells 68416
Total RAM Bits 1152000 Number of I/O 622
Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount
Operating Temperature ! 0°C ~ 85°C (TJ) Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31) Base Product Number EP2C70

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