H26M41208HPR
e-MMC5.1 with 8GB storage and 64Gb x 1 in 153-ball FBGA formH26M41208HPR
e-MMC5.1 with 8GB storage and 64Gb x 1 in 153-ball FBGA form
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Manufacturer Part # : H26M41208HPR
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Package/Case: BGA153
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Brand: SKHYNIX
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Product Categories : Microcontrollers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
H26M41208HPR DataSheet
Pricing (USD)
Quantity | Unit Price | Ext. Price |
---|---|---|
1 | $5.333 | $5.33 |
10 | $4.626 | $46.26 |
30 | $4.194 | $125.82 |
100 | $3.832 | $383.20 |
These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.
Details
SK hynix e-NAND consists of NAND flash and MMC controller. E-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage collection, and ECC. e-NAND protects the data contents from the host sudden power off failure.Features • eMMC5.1 compatible (Backward compatible to eMMC4.5&eMMC5.0) • Bus mode - Data bus width : 1bit(default), 4bits, 8bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz • Operating Voltage Range - Vcc (NAND) : 2.7V - 3.6V - Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V • Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃) • Others - This product is compliance with the RoHS directive• Supported Features - HS400, HS200 - HPI, BKOPS, BKOP operation control - Packed CMD, CMD queuing - Cache, Cache barrier, Cache flushing report - Partitioning, RPMB, RPMB throughput improve - Discard, Trim, Erase, Sanitize - Write protect, Secure write protection - Lock/Unlock - PON, Sleep/Awake - Reliable Write - Boot feature, Boot partition - HW/SW Reset - Field Firmware Update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal typeApplication● Mobile communication base station● Measuring instrument● Synthesizer● Exchanger● High-end router
Key Features
- eMMC5.1 compatible (Backward compatible to eMMC4.5&eMMC5.0) Bus mode - Data bus width : 1bit(default), 4bits, 8bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz Operating Voltage Range - Vcc (NAND) : 2.7V - 3.6V - Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃) Others - This product is compliance with the RoHS directive
- Supported Features - HS400, HS200 - HPI, BKOPS, BKOP operation control - Packed CMD, CMD queuing - Cache, Cache barrier, Cache flushing report - Partitioning, RPMB, RPMB throughput improve - Discard, Trim, Erase, Sanitize - Write protect, Secure write protection - Lock/Unlock - PON, Sleep/Awake - Reliable Write - Boot feature, Boot partition - HW/SW Reset - Field Firmware Update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal type
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Active |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.51 | JESD-30 Code | R-PBGA-B153 |
Length | 13 mm | Memory Density | 68719476736 bit |
Memory IC Type | FLASH CARD | Memory Width | 8 |
Number of Functions | 1 | Number of Terminals | 153 |
Number of Words | 8589934592 words | Number of Words Code | 8000000000 |
Operating Mode ! | SYNCHRONOUS | Organization | 8GX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | VFBGA |
Package Equivalence Code | BGA153,14X14,20 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | Programming Voltage ! | 3.3 V |
Seated Height-Max | 0.8 mm | Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | OTHER | Terminal Form ! | BALL |
Terminal Pitch ! | 0.5 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Width | 11.5 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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