H26M41208HPR

Effective Inventory5,344

e-MMC5.1 with 8GB storage and 64Gb x 1 in 153-ball FBGA form

  • Manufacturer Part # : H26M41208HPR

  • Package/Case: BGA153

  • Brand: SKHYNIX

  • Product Categories : Microcontrollers

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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WireTransfer

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MoneyGram

Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

H26M41208HPR DataSheet

Pricing (USD)

Quantity Unit Price Ext. Price
1 $5.333 $5.33
10 $4.626 $46.26
30 $4.194 $125.82
100 $3.832 $383.20

These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.

Rapid Quote

Please submit RFQ for H26M41208HPR or email to us: Email: [email protected], we will contact you in 12 hours.

Details

SK hynix e-NAND consists of NAND flash and MMC controller. E-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage collection, and ECC. e-NAND protects the data contents from the host sudden power off failure.Features • eMMC5.1 compatible  (Backward compatible to eMMC4.5&eMMC5.0) • Bus mode - Data bus width : 1bit(default), 4bits, 8bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz • Operating Voltage Range - Vcc (NAND) : 2.7V - 3.6V - Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V • Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃) • Others - This product is compliance with the RoHS directive• Supported Features - HS400, HS200 - HPI, BKOPS, BKOP operation control - Packed CMD, CMD queuing - Cache, Cache barrier, Cache flushing report - Partitioning, RPMB, RPMB throughput improve - Discard, Trim, Erase, Sanitize - Write protect, Secure write protection - Lock/Unlock - PON, Sleep/Awake - Reliable Write - Boot feature, Boot partition - HW/SW Reset - Field Firmware Update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal typeApplication● Mobile communication base station● Measuring instrument● Synthesizer● Exchanger● High-end router

Key Features

  • eMMC5.1 compatible  (Backward compatible to eMMC4.5&eMMC5.0)  Bus mode - Data bus width : 1bit(default), 4bits, 8bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz  Operating Voltage Range - Vcc (NAND) : 2.7V - 3.6V - Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V  Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃)  Others - This product is compliance with the RoHS directive
  • Supported Features - HS400, HS200 - HPI, BKOPS, BKOP operation control - Packed CMD, CMD queuing - Cache, Cache barrier, Cache flushing report - Partitioning, RPMB, RPMB throughput improve - Discard, Trim, Erase, Sanitize - Write protect, Secure write protection - Lock/Unlock - PON, Sleep/Awake - Reliable Write - Boot feature, Boot partition - HW/SW Reset - Field Firmware Update - Configurable driver strength - Health(Smart) report - Production state awareness - Secure removal type

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Active
Reach Compliance Code compliant ECCN Code EAR99
HTS Code ! 8542.32.00.51 JESD-30 Code R-PBGA-B153
Length 13 mm Memory Density 68719476736 bit
Memory IC Type FLASH CARD Memory Width 8
Number of Functions 1 Number of Terminals 153
Number of Words 8589934592 words Number of Words Code 8000000000
Operating Mode ! SYNCHRONOUS Organization 8GX8
Package Body Material PLASTIC/EPOXY Package Code VFBGA
Package Equivalence Code BGA153,14X14,20 Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED Programming Voltage ! 3.3 V
Seated Height-Max 0.8 mm Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! OTHER Terminal Form ! BALL
Terminal Pitch ! 0.5 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED Width 11.5 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H26M41208HPR PDF Download

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