H5PS5162FFR-25C

CMOS DDR DRAM in PBGA84 package, HALOGEN FREE AND ROHS COMPLIANT
5,941 Effective Inventory

H5PS5162FFR-25C

Effective Inventory5,941

CMOS DDR DRAM in PBGA84 package, HALOGEN FREE AND ROHS COMPLIANT

  • Manufacturer Part # : H5PS5162FFR-25C

  • Package/Case: BGA84

  • Brand: SKHYNIX

  • Product Categories : Application Specific Clock/Timing

Quality Assurance

Quality Assurance

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H5PS5162FFR-25C DataSheet
no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5PS5162FFR-25C or email to us: Email: [email protected], we will contact you in 12 hours.

Details

Key Features• VDD = 1.8 +/- 0.1V• VDDQ = 1.8 +/- 0.1V• All inputs and outputs are compatible with SSTL_18 interface• 8 banks• Fully differential clock inputs (CK, /CK) operation• Double data rate interface• Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS)• Differential Data Strobe (DQS, DQS)• Data outputs on DQS, DQS edges when read (edged DQ)• Data inputs on DQS centers when write (centered DQ)• On chip DLL align DQ, DQS and DQS transition with CK transition• DM mask write data-in at the both rising and falling edges of the data strobe• All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock• Programmable CAS latency 3, 4, 5 and 6 supported• Programmable additive latency 0, 1, 2, 3, 4 and 5 supported• Programmable burst length 4/8 with both nibble sequential and interleave mode• Internal eight bank operations with single pulsed RAS• Auto refresh and self refresh supported• tRAS lockout supported• 8K refresh cycles /64ms• JEDEC standard 84ball FBGA(x16)• Full strength driver option controlled by EMR• On Die Termination supported• Off Chip Driver Impedance Adjustment supported• Self-Refresh High Temperature Entry• Average Refresh Cycle (Tcase 0 oC~ 95 oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC Commercial Temperature( 0oC ~ 85 oC) Industrial Temperature( -40oC ~ 95 oC)

H5PS5162FFR-25C

Key Features

  • VDD = 1.8 +/- 0.1V
  • VDDQ = 1.8 +/- 0.1V
  • All inputs and outputs are compatible with SSTL_18 interface
  • 8 banks
  • Fully differential clock inputs (CK, /CK) operation
  • Double data rate interface
  • Source synchronous-data transaction aligned to bidirectional data strobe (DQS, DQS)
  • Differential Data Strobe (DQS, DQS)
  • Data outputs on DQS, DQS edges when read (edged DQ)
  • Data inputs on DQS centers when write (centered DQ)
  • On chip DLL align DQ, DQS and DQS transition with CK transition
  • DM mask write data-in at the both rising and falling edges of the data strobe
  • All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
  • Programmable CAS latency 3, 4, 5 and 6 supported
  • Programmable additive latency 0, 1, 2, 3, 4 and 5 supported
  • Programmable burst length 4/8 with both nibble sequential and interleave mode
  • Internal eight bank operations with single pulsed RAS
  • Auto refresh and self refresh supported
  • tRAS lockout supported
  • 8K refresh cycles /64ms
  • JEDEC standard 84ball FBGA(x16)
  • Full strength driver option controlled by EMR
  • On Die Termination supported
  • Off Chip Driver Impedance Adjustment supported
  • Self-Refresh High Temperature Entry
  • Average Refresh Cycle (Tcase 0 oC~ 95 oC)
  • - 7.8 µs at 0oC ~ 85 oC
  • - 3.9 µs at 85oC ~ 95 oC
  • Commercial Temperature( 0oC ~ 85 oC)
  • Industrial Temperature( -40oC ~ 95 oC)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Obsolete
Part Package Code BGA Pin Count ! 84
Reach Compliance Code ECCN Code EAR99
HTS Code ! 8542.32.00.28 Access Mode ! FOUR BANK PAGE BURST
Access Time-Max 0.5 ns Additional Feature ! AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 400 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B208
JESD-609 Code e1 Length 13 mm
Memory Density 536870912 bit Memory IC Type DDR2 DRAM
Memory Width 16 Number of Functions 1
Number of Ports ! 1 Number of Terminals 84
Number of Words 33554432 words Number of Words Code 32000000
Operating Mode ! SYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 32MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TFBGA Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260 Power Supplies ! 1.8 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 4,8 Standby Current-Max 0.008 A
Supply Current-Max 0.28 mA Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! OTHER Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form ! BALL Terminal Pitch ! 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 20
Width 8 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H5PS5162FFR-25C PDF Download

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