MX25L6405DMI-12G

Name: MX25L6405DMI-12G
Rating: 4.5 (10 reviews)

Flash, 32MX2, PDSO16, 0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16

6,292 Effective Inventory

MX25L6405DMI-12G

Effective Inventory6,292

Flash, 32MX2, PDSO16, 0.300 INCH, ROHS COMPLIANT, MS-013, SOP-16

Manufacturer Part # : MX25L6405DMI-12G
Package/Case: SOP-16
Brand: MACRONIX
Product Categories : Microcontrollers

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We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

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Service & Packaging

About After Sales Service

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Initiate the application within 90 days from the shipment date.

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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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MX25L6405DMI-12G DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Details

GENERAL DESCRIPTION The MX25L1605D are 16,777,216 bit serial Flash memory, which is configured as 2,097,152 x 8 internally. When it is in two I/O read mode, the structure becomes 8,388,608 bits x 2. The MX25L3205D are 33,554,432 bit serial Flash memory, which is configured as 4,194,304 x 8 internally. When it is in two I/O read mode, the structure becomes 16,772,216 bits x 2. The MX25L6405D are 67,108,864 bit serial Flash memory, which is configured as 8,388,608 x 8 internally. When it is in two I/O read mode, the structure becomes 33,554,432 bits x 2. (please refer to the "Two I/O Read mode" section). The MX25L1605D/3205D/6405D feature a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). Serial access to the device is enabled by CS# input.FEATURES GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 16M:16,777,216 x 1 bit structure or 8,388,608 x 2 bits (two I/O read mode) structure 32M:33,554,432 x 1 bit structure or 16,772,216 x 2 bits (two I/O read mode) structure 64M:67,108,864 x 1 bit structure or 33,554,432 x 2 bits (two I/O read mode) structure • 512 Equal Sectors with 4K byte each (16Mb) 1024 Equal Sectors with 4K byte each (32Mb) 2048 Equal Sectors with 4K byte each (64Mb) - Any Sector can be erased individually • 32 Equal Blocks with 64K byte each (16Mb) 64 Equal Blocks with 64K byte each (32Mb) 128 Equal Blocks with 64K byte each (64Mb) - Any Block can be erased individually • Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V • Low Vcc write inhibit is from 1.5V to 2.5VPERFORMANCE • High Performance - Fast access time: 86MHz serial clock (15pF + 1TTL Load) and 66MHz serial clock (30pF + 1TTL Load) - Serial clock of two I/O read mode : 50MHz (15pF + TTL Load), which is equivalent to 100MHz - Fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page) - Byte program time: 9us (typical) - Continuously program mode (automatically increase address under word program mode) - Fast erase time: 60ms(typ.) /sector (4K-byte per sector) ; 0.7s(typ.) /block (64K-byte per block); 14s(typ.) /chip for 16Mb, 25s(typ.) for 32Mb, and 50s(typ.) for 64Mb • Low Power Consumption - Low active read current: 25mA(max.) at 86MHz, 20mA(max.) at 66MHz and 10mA(max.) at 33MHz - Low active programming current: 20mA (max.) - Low active erase current: 20mA (max.) - Low standby current: 20uA (max.) - Deep power-down mode 1uA (typical) • Typical 100,000 erase/program cycles

Key Features

GENERAL
Serial Peripheral Interface compatible -- Mode 0 and Mode 3
16M:16,777,216 x 1 bit structure or 8,388,608 x 2 bits (two I/O read mode) structure
32M:33,554,432 x 1 bit structure or 16,772,216 x 2 bits (two I/O read mode) structure
64M:67,108,864 x 1 bit structure or 33,554,432 x 2 bits (two I/O read mode) structure
512 Equal Sectors with 4K byte each (16Mb)
1024 Equal Sectors with 4K byte each (32Mb)
2048 Equal Sectors with 4K byte each (64Mb)
- Any Sector can be erased individually
32 Equal Blocks with 64K byte each (16Mb)
64 Equal Blocks with 64K byte each (32Mb)
128 Equal Blocks with 64K byte each (64Mb)
- Any Block can be erased individually
Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
Latch-up protected to 100mA from -1V to Vcc +1V
Low Vcc write inhibit is from 1.5V to 2.5V
PERFORMANCE
High Performance
- Fast access time: 86MHz serial clock (15pF + 1TTL Load) and 66MHz serial clock (30pF + 1TTL Load)
- Serial clock of two I/O read mode : 50MHz (15pF + TTL Load), which is equivalent to 100MHz
- Fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page)
- Byte program time: 9us (typical)
- Continuously program mode (automatically increase address under word program mode)
- Fast erase time: 60ms(typ.) /sector (4K-byte per sector) ; 0.7s(typ.) /block (64K-byte per block); 14s(typ.) /chip for 16Mb, 25s(typ.) for 32Mb, and 50s(typ.) for 64Mb
Low Power Consumption
- Low active read current: 25mA(max.) at 86MHz, 20mA(max.) at 66MHz and 10mA(max.) at 33MHz
- Low active programming current: 20mA (max.)
- Low active erase current: 20mA (max.)
- Low standby current: 20uA (max.)
- Deep power-down mode 1uA (typical)
Typical 100,000 erase/program cycles

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Part Package Code	SOIC	Pin Count !	16
Reach Compliance Code		ECCN Code	EAR99
HTS Code !	8542.32.00.51	Alternate Memory Width	1
Clock Frequency-Max (fCLK)	86 MHz	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-G16	Length	10.3 mm
Memory Density	67108864 bit	Memory IC Type	FLASH
Memory Width	2	Number of Functions	1
Number of Terminals	16	Number of Words	33554432 words
Number of Words Code	32000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	32MX2	Package Body Material	PLASTIC/EPOXY
Package Code	SOP	Package Equivalence Code	SOP16,.4
Package Shape	RECTANGULAR	Package Style	SMALL OUTLINE
Parallel/Serial	SERIAL	Peak Reflow Temperature (Cel)	NOT SPECIFIED
Power Supplies !	3/3.3 V	Programming Voltage !	2.7 V
Qualification Status !	Not Qualified	Seated Height-Max	2.65 mm
Serial Bus Type	SPI	Standby Current-Max	0.00002 A
Supply Current-Max	0.025 mA	Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	Supply Voltage-Nom (Vsup)	3 V
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	INDUSTRIAL	Terminal Form !	GULL WING
Terminal Pitch !	1.27 mm	Terminal Position	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	Type	NOR TYPE
Width	7.52 mm	Write Protection	HARDWARE/SOFTWARE

Specification Comparison

MX25L6408EMI-12G vs MX25L6473EM2I-10G vs MX25L6405DMI-12G

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification MX25L6405DMI-12G PDF Download