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NHPXA270C5C520
Lead-Free Plastic BGA-360NHPXA270C5C520
Lead-Free Plastic BGA-360
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
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NHPXA270C5C520 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
NHPXA270C5C520 DescriptionThe NHPXA270C5C520 processor is the first Intel processor to include Intel® Wireless MMX™ technology, enabling high-performance, low-power multimedia acceleration with a general-purpose instructionset. Intel® Quick Capture technology provides a flexible and powerful camera interface for capturing digital images and video. While performance is key in the PXA270 processor, power consumption is also a critical component. The new capabilities of Wireless Intel SpeedStep®technology set the standard for low-power consumption.NHPXA270C5C520 FeaturesHigh-performance processor:—Intel XScale® microarchitecture with Intel® Wireless MMX™ Technology—7 Stage pipeline—32 KB instruction cache—32 KB data cache—2 KB “mini” data cache—Extensive data buffering• 256 Kbytes of internal SRAM for high speed code or data storage preserved during low-power states• High-speed baseband processor interface (Mobile Scalable Link)• Rich serial peripheral set:—AC’97 audio port—I2S audio port—USB Client controller—USB Host controller—USB On-The-Go controller—Three high-speed UARTs (two with hardware flow control)• Hardware debug features — IEEE JTAG interface with boundary scan• Hardware performance-monitoring features with on-chip trace buffer• Real-time clock• Operating-system timers• LCD Controller• Universal Subscriber Identity Module interface• Low power:—Wireless Intel Speedstep® Technology—Less than 500 mW typical internal dissipation—Supply voltage may be reduced to 0.85 V—Four low-power modes—Dynamic voltage and frequency management• High-performance memory controller:—Four banks of SDRAM: up to 104 MHz @ 2.5V, 3.0V, and 3.3V I/O interface—Six static chip selects—Support for PCMCIA and Compact Flash—Companion chip interface• Flexible clocking:—CPU clock from 104 to 624 MHz—Flexible memory clock ratios—Frequency changes—Functional clock gating• Additional peripherals for system connectivity:—SD Card / MMC Controller (with SPI mode support)—Memory Stick card controller—Three SSP controllers—Two I2C controllers—Four pulse-width modulators (PWMs)—Keypad interface with both direct and matrix keys support—Most peripheral pins double as GPIOsNHPXA270C5C520 Applications• Automatic testing of products• Satellite communication• Home appliances• Computers and smartphones• Speed control of motor
Key Features
- High-performance processor:—Intel XScale® microarchitecture with Intel® Wireless MMX™ Technology—7 Stage pipeline—32 KB instruction cache—32 KB data cache—2 KB “mini” data cache—Extensive data buffering 256 Kbytes of internal SRAM for high speed code or data storage preserved during low-power states High-speed baseband processor interface (Mobile Scalable Link) Rich serial peripheral set:—AC’97 audio port—I2S audio port—USB Client controller—USB Host controller—USB On-The-Go controller—Three high-speed UARTs (two with hardware flow control) Hardware debug features — IEEE JTAG interface with boundary scan Hardware performance-monitoring features with on-chip trace buffer Real-time clock Operating-system timers LCD Controller Universal Subscriber Identity Module interface Low power:—Wireless Intel Speedstep® Technology—Less than 500 mW typical internal dissipation—Supply voltage may be reduced to 0.85 V—Four low-power modes—Dynamic voltage and frequency management High-performance memory controller:—Four banks of SDRAM: up to 104 MHz @ 2.5V, 3.0V, and 3.3V I/O interface—Six static chip selects—Support for PCMCIA and Compact Flash—Companion chip interface Flexible clocking:—CPU clock from 104 to 624 MHz—Flexible memory clock ratios—Frequency changes—Functional clock gating Additional peripherals for system connectivity:—SD Card / MMC Controller (with SPI mode support)—Memory Stick card controller—Three SSP controllers—Two I2C controllers—Four pulse-width modulators (PWMs)—Keypad interface with both direct and matrix keys support—Most peripheral pins double as GPIOs
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Transferred |
| Part Package Code | BGA | Pin Count ! | 360 |
| Reach Compliance Code | compliant | HTS Code ! | 8542.31.00.01 |
| Address Bus Width ! | 26 | Bit Size | 32 |
| Boundary Scan | YES | Clock Frequency-Max | 3.6864 MHz |
| External Data Bus Width | 32 | Format | FIXED POINT |
| Integrated Cache | YES | JESD-30 Code | S-PBGA-B360 |
| JESD-609 Code | e1 | Low Power Mode | YES |
| Number of Terminals | 360 | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Shape | SQUARE |
| Package Style | GRID ARRAY | Qualification Status ! | Not Qualified |
| Speed | 520 MHz | Supply Voltage-Max | 1.595 V |
| Supply Voltage-Min | 1.3775 V | Supply Voltage-Nom | 1.45 V |
| Surface Mount ! | YES | Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER | Terminal Form ! | BALL |
| Terminal Position | BOTTOM | uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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