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SPC5777CK3MME3
High-performance processing chip
SPC5777CK3MME3
High-performance processing chip
Quality Assurance
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All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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SPC5777CK3MME3 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
SPC5777CK3MME3 is a high-performance electronic component categorized as an e200z7 MPC57xx Microcontroller IC. It features a 32-bit tri-core architecture with a clock speed of 264MHz, making it suitable for demanding applications that require fast processing capabilities. The microcontroller also includes 8MB of flash memory (8M x 8), providing ample storage space for program code and data. Additionally, the SPC5777CK3MME3 is housed in a 416-MAPBGA package measuring 27x27mm, offering a compact form factor that is ideal for space-constrained designs. This package type also provides good thermal performance, ensuring reliable operation even in high-temperature environments. With its advanced features and robust design, the SPC5777CK3MME3 is well-suited for a wide range of applications, including automotive, industrial control, and networking systems. Its tri-core architecture enables parallel processing, enhancing overall system performance and responsiveness. The microcontroller's high clock speed and ample flash memory make it suitable for real-time applications that require fast data processing and storage capabilities.
Key Features
- High-performance 32-bit Power Architecture® e200z7 Dual-Core with 300MHz
- 2MB on-chip flash memory and 64KB on-chip data SRAM
- Integrated safety mechanisms for ASIL D compliance
- Multi-core lock-step (MCLSP) architecture for fault tolerance
- Designed for automotive applications requiring high processing power and safety features
Application
- Automotive industry for engine control units
- Industrial control systems for factories and warehouses
- Medical devices for patient monitoring and diagnostics
- Aerospace industry for flight control systems
- Railway systems for signaling and communication
- Telecommunications industry for networking equipment
- Consumer electronics for smart devices and appliances
- Renewable energy systems for power generation and monitoring
- Defense sector for military communication and navigation systems
- Robotics industry for autonomous vehicles and industrial robots
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Active |
| Reach Compliance Code | compliant | ECCN Code | 5A992.C |
| HTS Code ! | 8542.31.00.01 | Factory Lead Time | 52 Weeks |
| Date Of Intro | 2016-03-08 | Has ADC | YES |
| Additional Feature ! | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. | Address Bus Width ! | |
| Bit Size | 32 | Boundary Scan | YES |
| CPU Family | E200Z7 | Clock Frequency-Max | 40 MHz |
| DAC Channels | NO | DMA Channels | YES |
| External Data Bus Width | Format | FLOATING-POINT | |
| Integrated Cache | YES | JESD-30 Code | S-PBGA-B416 |
| JESD-609 Code | e2 | Length | 27 mm |
| Low Power Mode | YES | Moisture Sensitivity Level | 3 |
| Number of DMA Channels | 128 | Number of External Interrupts | 1 |
| Number of Serial I/Os | 5 | Number of Terminals | 416 |
| Number of Timers | On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | Operating Temperature-Max | 125 °C |
| Operating Temperature-Min | -40 °C | PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
| Package Equivalence Code | BGA416,26X26,40 | Package Shape | SQUARE |
| Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 260 |
| RAM (bytes) | 524288 | ROM (words) | 8388608 |
| ROM Programmability | FLASH | Seated Height-Max | 2.02 mm |
| Speed | 264 MHz | Supply Current-Max | 1350 mA |
| Supply Voltage-Max | 1.32 V | Supply Voltage-Min | 1.2 V |
| Surface Mount ! | YES | Technology | CMOS |
| Temperature Grade ! | AUTOMOTIVE | Terminal Finish | TIN SILVER |
| Terminal Form ! | BALL | Terminal Pitch ! | 1 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 40 |
| Width | 27 mm | uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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