TC55257DFL-70L

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Shipping & Payment

Shipping & Payment

About Shipping

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

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Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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TC55257DFL-70L DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for TC55257DFL-70L or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The TC55257DFL-70L is a cutting-edge SRAM chip engineered for power-sensitive environments. With a generous capacity of 256Kb, this low-power chip offers high-speed performance at 70ns. Whether you are designing for a mobile device, IoT application, or any other power-sensitive project, the TC55257DFL-70L is an ideal memory solution that prioritizes efficiency without compromising on speed or reliability

TC55257DFL-70L

Key Features

  • Multiplexed interface support
  • Fast access time of 25ns
  • Data retention at power-down

Application

  • Robot vacuums
  • Smart lights
  • Wireless chargers
Toshiba America Electronic Components Inventory

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Part Life Cycle Code Obsolete Part Package Code SOIC
Pin Count ! 28 Reach Compliance Code
Access Time-Max 70 ns JESD-30 Code R-PDSO-G28
Length 18.5 mm Memory Density 262144 bit
Memory IC Type STANDARD SRAM Memory Width 8
Number of Functions 1 Number of Ports ! 1
Number of Terminals 28 Number of Words 32768 words
Number of Words Code 32000 Operating Mode ! ASYNCHRONOUS
Operating Temperature-Max 70 °C Operating Temperature-Min
Organization 32KX8 Output Characteristics 3-STATE
Output Enable YES Package Body Material PLASTIC/EPOXY
Package Code SOP Package Shape RECTANGULAR
Package Style SMALL OUTLINE Parallel/Serial PARALLEL
Qualification Status ! Not Qualified Seated Height-Max 2.7 mm
Standby Voltage-Min 2 V Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V Supply Voltage-Nom (Vsup) 5 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Form ! GULL WING
Terminal Pitch ! 1.27 mm Terminal Position DUAL
Width 8.8 mm

Specification Comparison

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification TC55257DFL-70L PDF Download

FAQs

What is TC55257DFL-70L?

The TC55257DFL-70L is a low-power CMOS static RAM (SRAM) chip manufactured by Toshiba. It is designed for use in various electronic systems requiring high-speed and reliable data storage, such as industrial control systems, networking equipment, and automotive electronics.

How Does TC55257DFL-70L Work?

The TC55257DFL-70L operates as a non-volatile memory device that stores data using a static random access memory architecture. It offers fast access times and low power consumption, making it suitable for battery-powered or portable applications. The SRAM chip retains data as long as power is supplied to the device.

How Many Pins does TC55257DFL-70L have and What are the Functions of the Pinout Configuration?

The TC55257DFL-70L is housed in a 28-pin SSOP (Shrink Small Outline Package) package. The pinout configuration includes:

  • VCC: Power supply pin.
  • GND: Ground pin.
  • Address Pins (A0-A13): Input pins for memory address selection.
  • Data Pins (DQ0-DQ7): Bi-directional data input/output pins.
  • Chip Enable (CE), Output Enable (OE), Write Enable (WE): Control pins for memory operations.

What are the Pros and Cons of TC55257DFL-70L?

Pros:

  • High-Speed Operation: Offers fast access times for efficient data retrieval.
  • Low Power Consumption: Provides low power operation, suitable for battery-powered devices.
  • Non-Volatile Memory: Retains data without the need for constant power supply.
  • Compact Package: Housed in a space-efficient SSOP package for easy integration into system designs.

Cons:

  • Limited Storage Capacity: May not be suitable for applications requiring large data storage.
  • Relatively Small Data Bus: Features an 8-bit data bus, which may not meet the needs of high-bandwidth systems.
  • Additional Control Pins: Requires control signals for memory operations, adding complexity to system design.

Are There Any Equivalents/Alternatives to TC55257DFL-70L for Recommendation?

  • The CY62256 series from Cypress Semiconductor offers similar low-power SRAM solutions.
  • Alternatives to the TC55257DFL-70L include the AS6C1008 from Alliance Memory and the FM1608 from Ramtron/Cypress.

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