TDA3LXRBFABFQ1

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Ultra-low-power system-on-chip for advanced driver-assistance systems, featuring enhanced processing, imaging, and computer vision capabiliti

  • Manufacturer Part # : TDA3LXRBFABFQ1

  • Package/Case: FCBGA (ABF)-367

  • Brand: Texas Instruments

Quality Assurance

Quality Assurance

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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TDA3LXRBFABFQ1 DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for TDA3LXRBFABFQ1 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The TDA3x SoC, developed by Texas Instruments, is the premier choice for cutting-edge Advanced Driver Assistance Systems (ADAS) in the automotive industry. This highly optimized family of devices is designed to deliver superior performance, low power consumption, and a compact form factor, while enabling a more autonomous and collision-free driving experience. With its embedded vision technology, the TDA3x SoC supports a wide range of ADAS applications, including front camera, rear camera, surround view, radar, and fusion, all within a single architecture. The device boasts a heterogeneous, scalable architecture, integrating TMS320C66x DSP generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors to ensure efficient and effective ADAS vision analytics processing. Its Vision AccelerationPac, featuring an embedded vision engine (EVE), offloads vision analytics functionality from the application processor, thereby reducing power consumption and optimizing vision processing. Furthermore, the TDA3x SoC comes with a complete set of development tools, such as C compilers and debugging interfaces, to simplify programming and scheduling and provide developers with comprehensive resources for automotive ADAS applications

Key Features

  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

DSP type 1 C66x DSP (max) (MHz) 355, 500, 745
Operating system Android, Linux, RTOS Security Debug security, Device identity, Isolation firewalls, Secure boot & storage & programming, Software IP protection
Ethernet MAC 2-Port 1Gb switch TI functional safety category Functional Safety-Compliant
Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Rating Automotive
Operating temperature range (°C) -40 to 125

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