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TE28F800C3TA90
Flash, 512KX16, 90ns, PDSO48
TE28F800C3TA90
Flash, 512KX16, 90ns, PDSO48
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Service & Packaging
Service & Packaging
About After Sales Service
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Initiate the application within 90 days from the shipment date.
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TE28F800C3TA90 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
Device DescriptionThis section provides an overview of the Intel® Advanced+ Boot Block Flash Memory (C3) device features, packaging, signal naming, and device architecture.Product OverviewThe C3 device provides high-performance asynchronous reads in package-compatible densities with a 16 bit data bus. Individually-erasable memory blocks are optimally sized for code and data storage. Eight 4 Kword parameter blocks are located in the boot block at either the top or bottom of the device’s memory map. The rest of the memory array is grouped into 32 Kword main blocks.Product Features■ Flexible SmartVoltage Technology —2.7 V– 3.6 V Read/Program/Erase —12 V for Fast Production Programming■ 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option —Reduces Overall System Power■ High Performance —2.7 V– 3.6 V: 70 ns Max Access Time■ Optimized Architecture for Code Plus Data Storage —Eight 4 Kword Blocks, Top or Bottom Parameter Boot —Up to One Hundred-Twenty-Seven 32 Kword Blocks —Fast Program Suspend Capability —Fast Erase Suspend Capability■ Flexible Block Locking —Lock/Unlock Any Block —Full Protection on Power-Up —WP# Pin for Hardware Block Protection■ Low Power Consumption —9 mA Typical Read —7 A Typical Standby with Automatic Power Savings Feature (APS)■ Extended Temperature Operation —–40 °C to +85 °C■ 128-bit Protection Register —64 bit Unique Device Identifier —64 bit User Programmable OTP Cells■ Extended Cycling Capability —Minimum 100,000 Block Erase Cycles■ Software —Intel® Flash Data Integrator (FDI) —Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) —Intel Basic Command Set —Common Flash Interface (CFI)■ Standard Surface Mount Packaging —48-Ball µBGA*/VFBGA —64-Ball Easy BGA Packages —48-Lead TSOP Package■ ETOX™ VIII (0.13 µm) Flash Technology —16, 32 Mbit■ ETOX™ VII (0.18 µm) Flash Technology —16, 32, 64 Mbit■ ETOX™ VI (0.25 µm) Flash Technology —8, 16 and 32 Mbit
Key Features
- Flexible SmartVoltage Technology
- —2.7 V– 3.6 V Read/Program/Erase
- —12 V for Fast Production Programming
- 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
- —Reduces Overall System Power
- High Performance
- —2.7 V– 3.6 V: 70 ns Max Access Time
- Optimized Architecture for Code Plus Data Storage
- —Eight 4 Kword Blocks, Top or Bottom Parameter Boot
- —Up to One Hundred-Twenty-Seven 32 Kword Blocks
- —Fast Program Suspend Capability
- —Fast Erase Suspend Capability
- Flexible Block Locking
- —Lock/Unlock Any Block
- —Full Protection on Power-Up
- —WP# Pin for Hardware Block Protection
- Low Power Consumption
- —9 mA Typical Read
- —7 A Typical Standby with Automatic Power Savings Feature (APS)
- Extended Temperature Operation
- —–40 °C to +85 °C
- 128-bit Protection Register
- —64 bit Unique Device Identifier
- —64 bit User Programmable OTP Cells
- Extended Cycling Capability
- —Minimum 100,000 Block Erase Cycles
- Software
- —Intel® Flash Data Integrator (FDI)
- —Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice)
- —Intel Basic Command Set
- —Common Flash Interface (CFI)
- Standard Surface Mount Packaging
- —48-Ball µBGA/VFBGA
- —64-Ball Easy BGA Packages
- —48-Lead TSOP Package
- ETOX™ VIII (0.13 µm) Flash Technology
- —16, 32 Mbit
- ETOX™ VII (0.18 µm) Flash Technology
- —16, 32, 64 Mbit
- ETOX™ VI (0.25 µm) Flash Technology
- —8, 16 and 32 Mbit
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | No | Part Life Cycle Code | Obsolete |
| Reach Compliance Code | ECCN Code | EAR99 | |
| HTS Code ! | 8542.32.00.51 | Access Time-Max | 90 ns |
| Boot Block | TOP | Command User Interface | YES |
| Common Flash Interface | YES | Data Polling | NO |
| JESD-30 Code | R-PDSO-G48 | Length | 18.4 mm |
| Memory Density | 8388608 bit | Memory IC Type | FLASH |
| Memory Width | 16 | Number of Sectors/Size | 8,15 |
| Number of Terminals | 48 | Number of Words | 524288 words |
| Number of Words Code | 512000 | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C | Organization | 512KX16 |
| Package Body Material | PLASTIC/EPOXY | Package Code | TSSOP |
| Package Equivalence Code | TSSOP48,.8,20 | Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Parallel/Serial | PARALLEL |
| Power Supplies ! | 1.8/3.3,3/3.3 V | Programming Voltage ! | 3 V |
| Qualification Status ! | Not Qualified | Seated Height-Max | 1.2 mm |
| Sector Size | 4K,32K | Standby Current-Max | 0.000025 A |
| Supply Current-Max | 0.018 mA | Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3 V |
| Surface Mount ! | YES | Technology | CMOS |
| Temperature Grade ! | INDUSTRIAL | Terminal Form ! | GULL WING |
| Terminal Pitch ! | 0.5 mm | Terminal Position | DUAL |
| Toggle Bit | NO | Type | NOR TYPE |
| Width | 12 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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