TLV2371IDBV

Effective Inventory6,203

With a maximum offset of 6000uV and a bandwidth of 3MHz

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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TLV2371IDBV DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for TLV2371IDBV or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The TLV2371IDBV by Texas Instruments is a versatile operational amplifier that offers high performance in a compact package. With its rail-to-rail input and output capabilities, this amplifier is well-suited for various precision applications such as data acquisition systems and industrial control. Its impressive unity-gain bandwidth of 5.9 MHz and slew rate of 3.6 V/μs ensure efficient signal processing, making it a reliable choice for critical operations

Key Features

  • Single Channel Low Distortion Amplifier
  • Low Distortion: 0.3mVrms at 1kHz
  • Low Power Consumption: 300μA per channel
  • Rail-to-Rail Output
  • Thermal Shutdown Protection

Application

  • Surveillance cameras
  • Navigation systems
  • Smart meters

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Part Life Cycle Code Obsolete Part Package Code SOT-23
Pin Count ! 5 Reach Compliance Code
ECCN Code EAR99 HTS Code ! 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00006 µA Bias Current-Max (IIB) @25C 0.00006 µA
Common-mode Reject Ratio-Min 55 dB Common-mode Reject Ratio-Nom 72 dB
Frequency Compensation ! YES Input Offset Current-Max (IIO) 0.00006 µA
Input Offset Voltage-Max 4500 µV JESD-30 Code R-PDSO-G5
JESD-609 Code e4 Length 2.9 mm
Low-Bias YES Low-Offset NO
Micropower ! NO Number of Functions 1
Number of Terminals 5 Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C Package Body Material PLASTIC/EPOXY
Package Code LSSOP Package Equivalence Code TSOP5/6,.11,37
Package Shape RECTANGULAR Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Power NO Programmable Power ! NO
Qualification Status ! Not Qualified Seated Height-Max 1.45 mm
Slew Rate-Min 1 V/us Slew Rate-Nom 2.4 V/us
Supply Current-Max 0.66 mA Supply Voltage Limit-Max 16.5 V
Supply Voltage-Nom (Vsup) 5 V Surface Mount ! YES
Technology CMOS Temperature Grade ! AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Terminal Form ! GULL WING
Terminal Pitch ! 0.95 mm Terminal Position DUAL
Unity Gain BW-Nom 3000 Wideband YES
Width 1.6 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification TLV2371IDBV PDF Download

FAQs

What is TLV2371IDBV?

The TLV2371IDBV is a low-power, precision CMOS operational amplifier designed by Texas Instruments. It is ideal for applications requiring low voltage operation, low offset voltage, and high open-loop gain, such as sensor interfaces, portable devices, and battery-powered systems.

How Does TLV2371IDBV Work?

The TLV2371IDBV operates as a precision operational amplifier with low offset voltage and high open-loop gain. It amplifies input signals with high accuracy and stability, making it suitable for precision measurement and signal conditioning applications. The amplifier features rail-to-rail input and output, ensuring maximum signal swing even at low supply voltages.

How Many Pins does TLV2371IDBV have and What are the Functions of the Pinout Configuration?

The TLV2371IDBV is housed in an 8-lead SOIC (Small Outline Integrated Circuit) package. The pinout configuration includes:

  • V+: Positive power supply pin.
  • V-: Negative power supply pin.
  • IN+: Non-inverting input pin.
  • IN-: Inverting input pin.
  • OUT: Output pin.

What are the Pros and Cons of TLV2371IDBV?

Pros:

  • Low Power Consumption: Operates with very low power, making it ideal for battery-operated devices.
  • Precision: Provides low offset voltage and low drift, ensuring accurate signal amplification.
  • Rail-to-Rail Input and Output: Maximizes signal swing, enhancing dynamic range.
  • High Open-Loop Gain: Suitable for applications requiring high gain and precision amplification.

Cons:

  • Limited Bandwidth: May not be suitable for high-frequency applications.
  • External Components: May require additional external components for optimal performance in certain applications.
  • Package Handling: The 8-lead SOIC package may be challenging to handle without appropriate equipment.

Are There Any Equivalents/Alternatives to TLV2371IDBV for Recommendation?

  • The equivalent part to the TLV2371IDBV is the MCP602 from Microchip Technology.
  • Alternatives to the TLV2371IDBV include the LMC6482 from Texas Instruments and the TS912 from STMicroelectronics.

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