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W632GG6KB15I
128Mx16 DDR3 DRAM Chip
W632GG6KB15I
128Mx16 DDR3 DRAM Chip
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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W632GG6KB15I DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The W632GG6KB15I chip represents the pinnacle of semiconductor innovation, with its DDR4 SDRAM technology delivering exceptional performance and energy efficiency. Its high-speed data transfer capabilities cater to the demanding requirements of modern computing and networking devices. Backed by a compact yet robust design, this chip has earned its reputation as a preferred solution for meeting the diverse semiconductor needs of the electronics industry
Key Features
- Power Supply: VDD, VDDQ = 1.5V ± 0.075V
- Double Data Rate architecture: two data transfers per clock cycle
- Eight internal banks for concurrent operation
- 8 bit prefetch architecture
- CAS Latency: 6, 7, 8, 9, 10, 11 and 13
- Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
- Programmable read burst ordering: interleaved or nibble sequential
- Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
- Edge-aligned with read data and center-aligned with write data
- DLL aligns DQ and DQS transitions with clock
- Differential clock inputs (CK and CK#)
- Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
- Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
- Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
- Auto-precharge operation for read and write bursts
- Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
- Precharged Power Down and Active Power Down
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Part Package Code | BGA | Pin Count ! | 96 |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code ! | 8542.32.00.36 | Access Mode ! | MULTI BANK PAGE BURST |
| Access Time-Max | 0.255 ns | Additional Feature ! | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 667 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 8 | JESD-30 Code | R-PBGA-B96 |
| Length | 13 mm | Memory Density | 2147483648 bit |
| Memory IC Type | DDR3 DRAM | Memory Width | 16 |
| Number of Functions | 1 | Number of Ports ! | 1 |
| Number of Terminals | 96 | Number of Words | 134217728 words |
| Number of Words Code | 128000000 | Operating Mode ! | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
| Organization | 128MX16 | Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
| Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies ! | 1.5 V | Qualification Status ! | Not Qualified |
| Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
| Self Refresh | YES | Sequential Burst Length | 8 |
| Standby Current-Max | 0.065 A | Supply Current-Max | 0.37 mA |
| Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
| Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
| Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 9 mm | Ihs Manufacturer | WINBOND ELECTRONICS CORP |
| Package Description | TFBGA, BGA96,9X16,32 |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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