XAM69A98ATNGHAALY

Name: XAM69A98ATNGHAALY
Rating: 4.5 (10 reviews)

With the AMA processor, you can achieve real-time video analytics, object detection, and tracking in various surveillance and IoT applications

4,987 Effective Inventory

XAM69A98ATNGHAALY

Effective Inventory4,987

With the AMA processor, you can achieve real-time video analytics, object detection, and tracking in various surveillance and IoT applications

Manufacturer Part # : XAM69A98ATNGHAALY
Package/Case: FCBGA-1414
Brand: Texas Instruments

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

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About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

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XAM69A98ATNGHAALY DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Details

One of the key features of the AM69 processor is its integration of deep learning accelerators, allowing for performance of up to 32 Trillion Operations Per Second (TOPS). This high level of performance is achieved while maintaining industry-leading power efficiency, even under the most challenging operating conditions. Additionally, the processor includes integrated safety and security features to protect data and ensure reliable operation up to SIL-2 levels

Key Features

Processor cores:

Up to eight 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2 GHz
- 2MB shared L2 cache per quad-core Cortex®-A72 cluster
- 32KB L1 D-Cache and 48KB L1 I-Cache per Cortex®-A72 core
Up to Four Deep Learning Accelerators:
- Each with up to 8 Trillion Operations Per Second (TOPS)
- Total of 32 Trillion Operations Per Second (32 TOPS)
Dual-core Arm Cortex-R5F MCUs at up to 1.0 GHz in General Compute partition with FFI
- 16KB L1 D-Cache, 16KB L1 I-Cache, and 64KB L2 TCM
Dual-core Arm® Cortex®-R5F MCUs at up to 1.0 GHz to support Device Management
- 32K L1 D-Cache, 32K I-Cache, and 64K L2 TCM with SECDED ECC on all memories
Up to two Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
- 480 MPixel/s ISP
- Support for up to 16-bit input RAW format
- Wide Dynamic Range (WDR), Lens Distortion Correction (LDC), Vision Imaging Subsystem (VISS), and Multi-Scalar (MSC) support
- Output color format : 8-bits, 12-bits, and YUV 4:2:2, YUV 4:2:0, RGB, HSV/HSL
Multimedia:
- Display subsystem supports:
  - Up to 4 displays
  - Up to two DSI 4L TX (up to 2.5K)
  - One eDP 4L
  - One DPI 24-bit RGB parallel interface
  - OLDI/LVDS (4 lanes - 2x) and 24-bit RGB parallel interface
  - Safety features such as freeze frame detection and MISR data check
- 3D Graphics Processing Unit
  - IMG BXS-4-64, up to 800 MHz
  - 50 GFLOPS, 4 GTexels/s
  - >500 MTexels/s, >8 GFLOPs
  - Supports at least 2 composition layers
  - Supports up to 2048x1080 @60fps
  - Supports ARGB32, RGB565 and YUV formats
  - 2D graphics capable
  - OpenGL ES 3.1, Vulkan 1.2
- Three CSI2.0 4L Camera Serial interface RX (CSI-RX) plus two CSI2.0 4L TX (CSI-TX) with DPHY
  - MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
  - Support for 1,2,3, or 4 data lane mode up to 1.5Gbps
  - ECC verification/correction with CRC check + ECC on RAM
  - Virtual Channel support (up to 16)
  - Ability to write stream data directly to DDR via DMA
- Two Video Encoder/Decoder Modules
  - Support for HEVC (H.265) Main profiles at Level 5.1 High-tier
  - Support for H.264 BaseLine/Main/High Profiles at Level 5.2
  - Support for up to 4K UHD resolution (3840 × 2160) per module
  - Each module supports 4K60 H.264/H.265 Encode/Decode (up to 480 MP/s)
Memory subsystem:
Up to 8MB of on-chip L3 RAM with ECC and coherency
- ECC error protection
- Shared coherent cache
- Supports internal DMA engine
Up to Four External Memory Interface (EMIF) module with ECC
- Supports LPDDR4 memory types
- Supports speeds up to 4266 MT/s
- Up to 4x32-b bus with inline ECC up to 68 GB/s
General-Purpose Memory Controller (GPMC)
512KB on-chip SRAM in MAIN domain, protected by ECC
AEC-Q100 qualified on part number variants ending in Q1
Device security:
Secure boot with secure run-time support
Customer programmable root key, up to RSA-4K or ECC-512
Embedded hardware security module
Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial interfaces:
Integrated Ethernet switch supporting up to 8 external ports
- Two ports support 5Gb, 10Gb USXGMII or 5Gb XFI
- All ports support 1Gb, 2.5Gb SGMII
- All ports can support QSGMII. A maximum of 2 QSGMII can be enabled and uses all 8 internal lanes. 1 QSGMII interfaces uses 4 internal lanes.
Up to 4x2-L/2x4L PCI-Express (PCIe) Gen3 controllers
- Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
One USB 3.0 dual-role device (DRD) subsystem
- Enhanced SuperSpeed Gen1 Port
- Supports Type-C switching
- Independently configurable as USB host, USB peripheral, or USB DRD
Ethernet
Two RGMII/RMII interfaces
Automotive interfaces:
Twenty Modular Controller Area Network (MCAN) modules with full CAN-FD support
Audio interfaces:
Five Multichannel Audio Serial Port (MCASP) modules
Flash memory interfaces:
Embedded MultiMediaCard Interface ( eMMC™ 5.1)
One Secure Digital 3.0 / Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0
Universal Flash Storage (UFS 2.1) interface with two lanes
Two independent flash interfaces configured as
- One OSPI or HyperBus™ or QSPI flash interfaces, and
- One QSPI flash interface
System-on-Chip (SoC) architecture:
16-nm FinFET technology
31 mm × 31 mm, 0.8-mm pitch, 1414-pin FCBGA (ALY), enables IPC class 3 PCB routing
TPS6594-Q1 Companion Power Management ICs (PMIC):
Functional Safety support up to ASIL-D
Flexible mapping to support different use cases

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Arm CPU	8 Arm Cortex-A72	Arm (max) (MHz)	2000
CPU	64-bit	Display type	1 EDP, 2 DSI, MIPI DPI
Ethernet MAC	8-Port 2.5Gb switch	PCIe	4 PCIe Gen 3 switch
Hardware accelerators	1 video encode/decode accelerator, 2 vision pre-processing accelerators, 4 deep learning accelerators	Features	Vision Analytics
Operating system	Linux, QNX, RTOS	Security	Cryptography, Debug security, Device identity, Isolation firewalls, Secure boot, Secure storage & programming, Software IP protection, Trusted execution environment
Rating	Catalog	Operating temperature range (°C)	-40 to 105