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Specification Comparison: K9F1G08U0C-PIB0 vs K9F1G08U0C-PCB0 vs K9F1G08U0A-PCB0
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Part Number
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| Manufacturer | SAMSUNG | Samsung Electronics | SAMSUNG |
| Package | TSOP-48 | TSOP-I | TSOP-48 |
| Description | Time-Proven Processor Architecture: The 128MX8 processor boasts a strong track record of reliability | I 48-Pin Package 1 Gigabit Capacity 3.3 Voltage Operation NAND Flash Memory with Parallel Interface | NAND Flash Memory 128M x 8 |
| Stock | 5985 | 7000 | 4712 |
| Product Category | IC Chips | IC Chips | |
| Pbfree Code | Yes | ||
| Rohs Code | Yes | ||
| Part Life Cycle Code | Obsolete | ||
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.51 | ||
| Access Time-Max | 20 ns | ||
| Command User Interface | YES | ||
| Data Polling | NO | ||
| JESD-30 Code | R-PDSO-G48 | ||
| JESD-609 Code | e6 | ||
| Memory Density | 1073741824 bit | ||
| Memory IC Type | FLASH | ||
| Memory Width | 8 | ||
| Moisture Sensitivity Level | 3 | ||
| Number of Sectors/Size | 1K | ||
| Number of Terminals | 48 | ||
| Number of Words | 134217728 words | ||
| Number of Words Code | 128000000 | ||
| Operating Temperature-Max | 70 °C | ||
| Organization | 128MX8 | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | TSSOP | ||
| Package Equivalence Code | TSSOP48,.8,20 | ||
| Package Shape | RECTANGULAR | ||
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | ||
| Page Size | 2K words | ||
| Parallel/Serial | PARALLEL | ||
| Peak Reflow Temperature (Cel) | 260 | ||
| Power Supplies | 3/3.3 V | ||
| Qualification Status | Not Qualified | ||
| Ready/Busy | YES | ||
| Sector Size | 128K | ||
| Standby Current-Max | 0.00005 A | ||
| Supply Current-Max | 0.03 mA | ||
| Surface Mount | YES | ||
| Technology | CMOS | ||
| Temperature Grade | COMMERCIAL | ||
| Terminal Finish | TIN BISMUTH | ||
| Terminal Form | GULL WING | ||
| Terminal Pitch | 0.5 mm | ||
| Terminal Position | DUAL | ||
| Toggle Bit | NO | ||
| Type | SLC NAND TYPE |
Part Number
Start with: K9F1G
Part Number "K9F1G" returned 20 results; all results matched and started with "K9F1G".
| Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|---|
| K9F1G08U0B-PCB0 |
SLC NAND Flash Parallel 3.3V 1G-bit 128M x 8 25us 48-Pin TSOP-I |
SAMSUNG | TSOP48 | 3~7 Days | 6,252.00 | ||
| K9F1G08U0D-SIB0 |
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SAMSUNG | TSOP48 | 3~7 Days | 6,704.00 | ||
| K9F1G08U0E-SCB0 |
Superior reliability and speed make this device perfect for industrial use cases |
Samsung | TSOP48 | 3~7 Days | 7,624.00 | ||
| K9F1G08 |
K9F1G08 is a NAND Flash memory chip with a capacity of 1Gbit. |
SPANSION | TSSOP4 | 3~7 Days | 5,442.00 | ||
| K9F1G08R0B-JIB0 |
Flash, 128MX8, PDSO48 |
SAMSUNG | BGA-63 | 3~7 Days | 3,443.00 | ||
| K9F1G08UOC |
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SAMSUNG | TSSOP | 3~7 Days | 5,983.00 | ||
| K9F1G08U0D-SCB0 |
Suitable for various applications |
Samsung Semiconductor | TSOP48 | 3~7 Days | 5,662.00 | ||
| K9F1G08U0F-SCB0 |
AEC-Q100 Certified 1Gb F-die NAND Flash |
Samsung Electronics | TSOP-1 | ACTIVE | 3~7 Days | 5,412.00 | |
| K9F1G080U0M-YIB0 |
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SAMSUNG | 3~7 Days | 5,956.00 | |||
| K9F1G08Q0M-YCB0 |
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SAMSUNG | TSOP | 3~7 Days | 108.00 | ||
| K9F1G08R |
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FBGA | 3~7 Days | 2,500.00 | |||
| K9F1G08R0A-JIB0 |
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SAMSUNG | BGA-63 | 3~7 Days | 649.00 | ||
| K9F1G08R0B-JCB0 |
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SAMSUNG | BGA | 3~7 Days | 6,532.00 | ||
| K9F1G08U0A-FIB0 |
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SAMSUNG | TSSOP | 3~7 Days | 1,000.00 | ||
| K9F1G08U0A-JIB0 |
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SAMSUNG | FBGA | 3~7 Days | 637.00 | ||
| K9F1G08U0A-PCB0 |
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SAMSUNG | TSOP-48 | 3~7 Days | 1.00 | ||
| K9F1G08U0A-PIB0 |
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SAMSUNG | TSOP48 | 3~7 Days | 27.00 | ||
| K9F1G08U0A-PIB0T00 |
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SAMSUNG | TSOP | 3~7 Days | 1,177.00 | ||
| K9F1G08R0C-JIB0 |
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SAMSUNG | BGA | 3~7 Days | 5,751.00 | ||
| K9F1G08U0A-PCB0T |
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SAMSUNG | 3~7 Days | 1,482.00 |