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Specification Comparison: MT41J128M16JT-093G:K vs MT41J128M8JP-15E:G vs MT41J128M16HA-125:D
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| Manufacturer | MICRON | MICRON | MICRON |
| Package | 96-TFBGA | FBGA-96 | FBGA9x14-96 |
| Description | 128 megabyte x 16 dynamic random access memory with ball grid array packaging | Low-power consumption and high-density design make it ideal for mobile devices | DDR3 SDRAM 2Gbit DRAM Chip 128Mx16 |
| Stock | 5949 | 6975 | 4829 |
| Part Life Cycle Code | Obsolete | Obsolete | Obsolete |
| Reach Compliance Code | compliant | compliant | |
| ECCN Code | EAR99 | EAR99 | EAR99 |
| HTS Code | 8542.32.00.36 | 8542.32.00.32 | 8542.32.00.36 |
| Access Mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
| Additional Feature | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 Code | R-PBGA-B96 | R-PBGA-B78 | R-PBGA-B96 |
| Length | 14 mm | 11.5 mm | 14 mm |
| Memory Density | 2147483648 bit | 1073741824 bit | 2147483648 bit |
| Memory IC Type | DDR DRAM | DDR3 DRAM | DDR3 DRAM |
| Memory Width | 16 | 8 | 16 |
| Number of Functions | 1 | 1 | 1 |
| Number of Ports | 1 | 1 | 1 |
| Number of Terminals | 96 | 78 | 96 |
| Number of Words | 134217728 words | 134217728 words | 134217728 words |
| Number of Words Code | 128000000 | 128000000 | 128000000 |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Organization | 128MX16 | 128MX8 | 128MX16 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Code | TFBGA | TFBGA | TFBGA |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Seated Height-Max | 1.2 mm | 1.2 mm | 1.2 mm |
| Self Refresh | YES | YES | YES |
| Supply Voltage-Max (Vsup) | 1.575 V | 1.575 V | 1.575 V |
| Supply Voltage-Min (Vsup) | 1.425 V | 1.425 V | 1.425 V |
| Supply Voltage-Nom (Vsup) | 1.5 V | 1.5 V | 1.5 V |
| Surface Mount | YES | YES | YES |
| Technology | CMOS | CMOS | CMOS |
| Terminal Form | BALL | BALL | BALL |
| Terminal Pitch | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal Position | BOTTOM | BOTTOM | BOTTOM |
| Width | 8 mm | 8 mm | 9 mm |
| Pbfree Code | Yes | Yes | |
| Rohs Code | Yes | Yes | |
| Part Package Code | BGA | BGA | |
| Pin Count | 78 | 96 | |
| Access Time-Max | 0.125 ns | 0.225 ns | |
| Clock Frequency-Max (fCLK) | 667 MHz | 800 MHz | |
| I/O Type | COMMON | COMMON | |
| Interleaved Burst Length | 8 | 8 | |
| JESD-609 Code | e1 | e1 | |
| Operating Temperature-Max | 85 °C | 85 °C | |
| Output Characteristics | 3-STATE | 3-STATE | |
| Package Equivalence Code | BGA78,9X13,32 | BGA96,9X16,32 | |
| Power Supplies | 1.5 V | 1.5 V | |
| Qualification Status | Not Qualified | Not Qualified | |
| Refresh Cycles | 8192 | 8192 | |
| Sequential Burst Length | 8 | 8 | |
| Supply Current-Max | 0.49 mA | 0.475 mA | |
| Temperature Grade | OTHER | OTHER | |
| Terminal Finish | TIN SILVER COPPER | TIN SILVER COPPER | |
| Standby Current-Max | 0.012 A |
Part Number
Start with: MT41J
Part Number "MT41J" returned 20 results; all results matched and started with "MT41J".
| Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|---|
| MT41J64M16JT-125:G |
FBGA-96 MT41J64M16JT-125:G DDR SDRAM ROHS |
Micron Technology | 96-TFBGA | OBSOLETE | 3~7 Days | 6,251.00 | |
| MT41J128M16JT-125 |
Advanced technology enables faster data transfer rates up to Mbp |
Micron Technology Inc | FBGA96 | 3~7 Days | 5,053.00 | ||
| MT41J128M8JP-125:G |
128Mx8, 0.1ns, 8 x 11.50 mm |
micron technology | TFBGA78 | OBSOLETE | 3~7 Days | 7,237.00 | |
| MT41J256M16HA-093:E |
DDR3 SDRAM DRAM chip |
Micron Technology | TFBGA-96 | 3~7 Days | 3,249.00 | ||
| MT41J128M16HA-15E:D |
2 gigabyte IC DRAM module housed in a 96-ball grid array package, specifically engineered for parallel computing tasks |
Micron Technology | BGA | 3~7 Days | 3,241.00 | ||
| MT41J256M16HA-125:E |
MT41J256M16HA-125:E is a DDR3 SDRAM DRAM chip with a capacity of 4Gbit |
Micron Technology | BGA | 3~7 Days | 7,749.00 | ||
| MT41J64M16TW-093:J |
High-Density CMOS Memory Module |
Micron Technology | FBGA-96 | 3~7 Days | 7,992.00 | ||
| MT41J128M16JT-125:K |
Technology: DRAM |
Micron Technology | FBGA-96 | ACTIVE | 3~7 Days | 6,957.00 | |
| MT41J64M16JT-15E:G |
Ninety-six ball plastic ball grid array packaged double data rate synchronous dynamic random access memory |
Micron Technology | TFBGA-96 | OBSOLETE | 3~7 Days | 6,927.00 | |
| MT41J256M8DA-125:M |
Reliable and scalable data storage for demanding enterprise environment |
MICRON | FBGA8x10.5-78 | 3~7 Days | 4,180.00 | ||
| MT41J256M8HX-187E:D |
Lead-free and FBGA-78 design |
MICRON | 78-TFBGA | 3~7 Days | 7,526.00 | ||
| MT41J256M16HA-107:E |
Type: Module MT41J256M16HA-107:E |
Micron Technology | TFBGA-96 | 3~7 Days | 7,545.00 | ||
| MT41J64M16JT-15E AAT:G |
Cutting-edge RAM solution for improved system performance and responsivenes |
MICRON | 96-TFBGA | 3~7 Days | 6,892.00 | ||
| MT41J512M8THD-15E:D |
Compact 78-Pin FBGA package |
MICRON | FBGA-78 | 3~7 Days | 3,427.00 | ||
| MT41J64M16JT-15E IT:G |
Enhanced data transfer and capacity for improved system performance |
Micron Technology | TFBGA-96 | 3~7 Days | 5,362.00 | ||
| MT41J256M16RE-15E:D |
High-performance DDR DRAM solution for demanding applications |
MICRON | FBGA10x14-96 | 3~7 Days | 7,604.00 | ||
| MT41J128M16JT-093:K |
DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA Tray |
Micron Technology | BGA | ACTIVE | 3~7 Days | 6,822.00 | |
| MT41J64M16JT-125G |
FBGA-96 MT41J64M16JT-125:G DDR SDRAM ROHS |
MICRON | BGA | 3~7 Days | 6,898.00 | ||
| MT41J64M16LA |
MT41J64M16LA is a DDR3 SDRAM chip with 4Gb capacity and a 1.5V power supply voltage. |
MICRON | FBGA | 3~7 Days | 7,828.00 | ||
| MT41J256M16HA-093 |
MT41J256M16HA-093 is a DDR3 SDRAM chip with 2GB capacity, suitable for high-performance computing applications. |
MICRON | BGA | 3~7 Days | 5,435.00 |