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Specification Comparison: W25M02GWZEIT vs W25M02GWTCIT vs W25M02GVZEIG
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| Manufacturer | Winbond Electronics | Winbond | Winbond Electronics |
| Package | WDFN-8 | TFBGA-24 | WDFN-8 |
| Description | Upgrade to the W25M02GWZEIT Multichip Package 2G-bit Serial NAND flash for high-speed, low-power data storage solutions suitable for operating at 1 | Advanced SLC NAND flash technology for reliable storage solutions | Flash memory with 1GX2 capacity in a PDSO8 package |
| Stock | 8358 | 4720 | 7092 |
| Product Category | Multichip Packages | Multichip Packages | Multichip Packages |
| RoHS | Details | Details | Details |
| Type | NAND Flash, NOR Flash | NAND Flash, NOR Flash | NAND Flash, NOR Flash |
| Memory Size | 2 Gbit | 2 Gbit | 2 Gbit |
| Package / Case | WSON-8 | TFBGA-24 | WSON-8 |
| Series | W25M02GW | W25M02GW | W25M02GV |
| Mounting Style | SMD/SMT | SMD/SMT | SMD/SMT |
| Maximum Clock Frequency | 104 MHz | 104 MHz | 104 MHz |
| Minimum Operating Temperature | - 40 C | - 40 C | - 40 C |
| Maximum Operating Temperature | + 85 C | + 85 C | + 85 C |
| Brand | Winbond | Winbond | Winbond |
| Data Bus Width | 8 bit | 8 bit | 8 bit |
| Interface Type | SPI | SPI | SPI |
| Moisture Sensitive | Yes | Yes | Yes |
| Organization | 256 M x 8 | 256 M x 8 | 256 M x 8 |
| Product | NAND-Based MCPs | NAND-Based MCPs | NAND-Based MCPs |
| Product Type | Multichip Packages | Multichip Packages | Multichip Packages |
| Factory Pack Quantity | 126 | 480 | 126 |
| Subcategory | Memory & Data Storage | Memory & Data Storage | Memory & Data Storage |
| Supply Voltage - Max | 1.95 V | 1.95 V | 3.6 V |
| Supply Voltage - Min | 1.7 V | 1.7 V | 2.7 V |
| Tradename | SpiStack | SpiStack | SpiStack |
| Unit Weight | 0.066619 oz | 0.118107 oz |
Part Number
Start with: W25M0
Part Number "W25M0" returned 22 results; all results matched and started with "W25M0".
| Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|---|
| W25M02GWZEIG |
1.8V Multichip Packages 2G-bit Serial NAND flash |
Winbond | SON | 3~7 Days | 3,242.00 | ||
| W25M02GVSFIT TR |
Upgrade your device's memory with this 2G-bit flash |
Winbond Electronics | SOIC-16 | 3~7 Days | 7,481.00 | ||
| W25M02GVZEJG |
This bit SLC NAND flash memory is designed for quad I/O operations at speeds up to MHz with a ns access tim |
Winbond Electronics | WDFN-8 | 3~7 Days | 7,040.00 | ||
| W25M02GVSFIT |
This high-density flash memory chip is designed for industrial and consumer applications requiring low power consumption and fast access time |
Winbond Electronics | SOIC-16 | 3~7 Days | 6,944.00 | ||
| W25M02GVTBJR |
High-speed flash memory solution for demanding application |
Winbond Electronics | TBGA-24 | 3~7 Days | 6,912.00 | ||
| W25M02GVTCIR |
High-speed SPI NAND flash memory for reliable data storage" |
Winbond Electronics | TBGA-24 | 3~7 Days | 2,928.00 | ||
| W25M02GVTCJT |
High-density, high-performance SPI NAND flash memory for embedded systems application |
Winbond Electronics | TBGA-24 | 3~7 Days | 4,323.00 | ||
| W25M02GVZEJR |
High-performance storage for data-intensive applications |
Winbond Electronics | WDFN-8 | 3~7 Days | 3,264.00 | ||
| W25M02GVTBJG |
Ultra-fast SPI interface with quad I/O configuration for high-speed data transfer |
Winbond Electronics | TBGA-24 | 3~7 Days | 5,660.00 | ||
| W25M02GVZEJT |
Low-power, high-capacity storage solution for industrial and consumer devices |
Winbond Electronics | WDFN-8 | 3~7 Days | 4,247.00 | ||
| W25M02GVTBJT |
Fast and low-power SPI interface enables efficient data transfe |
Winbond Electronics | TBGA-24 | 3~7 Days | 4,020.00 | ||
| W25M02GVSFJG |
Compact 16-SOIC package for easy integration |
Winbond Electronics | SOIC-16 | 3~7 Days | 7,651.00 | ||
| W25M02GVSFIR |
Enhance your device's memory capabilities with this rugged 2Gbit NAND Flash Memory IC |
Winbond Electronics | SOIC-16 | 3~7 Days | 3,612.00 | ||
| W25M02GVTCJG |
Quad I/O technology allows for faster data transfer and improved performance |
Winbond Electronics | TBGA-24 | 3~7 Days | 3,431.00 | ||
| W25M02GVTBIR |
Compact 24-TFBGA package for space-saving storage solutions |
Winbond Electronics | TBGA-24 | 3~7 Days | 4,876.00 | ||
| W25M02GVSFJR |
Advanced bit storage solution for industrial control system |
Winbond Electronics | SOIC-16 | 3~7 Days | 4,618.00 | ||
| W25M02GWTBIG |
Advanced multichip design for fast data transfer rate |
Winbond | TFBGA-24 | 3~7 Days | 4,144.00 | ||
| W25M02GVTCIT |
Low-power consumption for battery-operated and power-sensitive designs |
Winbond | TFBGA-24 | 3~7 Days | 4,610.00 | ||
| W25M02GVTCIG |
Fast access with 7ns speed, ideal for quick data transfers |
Winbond Electronics | 24-TBGA | 3~7 Days | 5,359.00 | ||
| W25M02GWTCIG TR |
Ultra-compact serial NAND flash memory for space-constrained devices |
Winbond | TFBGA-24 | 3~7 Days | 4,644.00 | ||
| W25M02GVSFJT |
Compact -pin SOIC package offers efficient usage of PCB space for embedded systems application |
Winbond Electronics | 16-SOIC (0.295", 7.50mm Width) | 3~7 Days | 2,295.00 | ||
| W25M02GVZEIT TR |
Reliable multichip package for demanding digital designs |
Winbond | WSON-8 | 3~7 Days | 3,056.00 |