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H5TQ4G63AFR-PBC
Packaged in a 96-ball FBGA with PBGA design, utilizing CMOS technology for efficient performanceH5TQ4G63AFR-PBC
Packaged in a 96-ball FBGA with PBGA design, utilizing CMOS technology for efficient performance
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Manufacturer Part # : H5TQ4G63AFR-PBC
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Package/Case: BGA96
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Brand: Hynix
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Product Categories : Memory
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
H5TQ4G63AFR-PBC DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The H5TQ4G63AFR-PBC is a 4Gb LPDDR4X SDRAM (Low Power Double Data Rate 4X Synchronous Dynamic Random Access Memory) designed for use in mobile devices such as smartphones and tablets. It offers a data transfer rate of up to 4266Mbps and operates at a low voltage of 1.1V, making it energy-efficient and suitable for battery-powered devices.This LPDDR4X SDRAM features a x16 I/O interface, a burst length of 8 or 16, and supports on-die termination (ODT) and off-chip driver (OCD) calibration, ensuring high-speed and reliable data transmission. The H5TQ4G63AFR-PBC also incorporates advanced power-saving features such as temperature-compensated self-refresh (TCSR) and deep power-down mode to further reduce power consumption when the device is idle.
Key Features
- This is a 2Gb DDR3 SDRAM IC
- Operates at a frequency of up to 533MHz
- Features low power consumption with a voltage supply of 1.2V
Application
- Maximize your device's capabilities
- Seamless data transfer experience
- Unleash the power of H5TQ4G63AFR-PBC
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Part Package Code | BGA | Pin Count ! | 96 |
| Reach Compliance Code | ECCN Code | EAR99 | |
| HTS Code ! | 8542.32.00.36 | Access Mode ! | MULTI BANK PAGE BURST |
| Access Time-Max | 0.225 ns | Additional Feature ! | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 800 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B96 |
| Length | 13 mm | Memory Density | 4294967296 bit |
| Memory IC Type | DDR3 DRAM | Memory Width | 16 |
| Number of Functions | 1 | Number of Ports ! | 1 |
| Number of Terminals | 96 | Number of Words | 268435456 words |
| Number of Words Code | 256000000 | Operating Mode ! | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
| Organization | 256MX16 | Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
| Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies ! | 1.5 V | Qualification Status ! | Not Qualified |
| Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
| Self Refresh | YES | Sequential Burst Length | 4,8 |
| Standby Current-Max | 0.017 A | Supply Current-Max | 0.22 mA |
| Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
| Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | OTHER |
| Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 9 mm |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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