H5TQ4G63CFR-RDC

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  • Manufacturer Part # : H5TQ4G63CFR-RDC

  • Package/Case: FBGA

  • Part Status : OBSOLETE

  • Brand: Sk Hynix

  • Product Categories : Memory

  • RoHS:

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

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H5TQ4G63CFR-RDC DataSheet

no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5TQ4G63CFR-RDC or email to us: Email: [email protected], we will contact you in 12 hours.

Details

Designed for seamless integration into smartphones, tablets, and various portable devices, the H5TQ4G63CFR-RDC synchronous DRAM module sets a new standard for memory performance. Boasting a 4 gigabit (Gb) capacity that translates to 512 megabytes (MB) with an 8-bit data bus configuration, this module thrives on efficiency. Operating at a low supply voltage of 1.8 volts (V), it offers lightning-fast data transfer speeds in the realm of several gigabits per second (Gbps). The protective conformal coating denoted by "CFR" shields the module from environmental factors, ensuring longevity and resilience. Meanwhile, the "RDC" designation hints at specific manufacturing nuances or revisions that further enhance the module's functionality

H5TQ4G63CFR-RDC

Key Features

VDD=VDDQ=1.5V +/- 0.075V Fully differential clock inputs (CK, CK) operation Differential Data Strobe (DQS, DQS) On chip DLL align DQ, DQS and DQS transition with CK transition DM masks write data-in at the both rising and falling edges of the data strobe All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported Programmable additive latency 0, CL-1, and CL-2 supported Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10 Programmable burst length 4/8 with both nibble sequential and interleave mode BL switch on the fly 8banks Average Refresh Cycle (Tcase of0 oC~ 95oC)- 7.8 s at 0oC ~ 85 oC- 3.9 s at 85oC ~ 95 oC JEDEC standard 78ball FBGA(x4/x8) Driver strength selected by EMRS Dynamic On Die Termination supported Asynchronous RESET pin supported ZQ calibration supported TDQS (Termination Data Strobe) supported (x8 only) Write Levelization supported 8 bit pre-fetch

Application

  • Perfect for mobile devices
  • Compact size, high speed
  • Energy efficient solution

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

ECCN (US) EAR99 Part Status ! Obsolete
Automotive No PPAP No
DRAM Type DDR3 SDRAM Chip Density (bit) 4G
Organization 256Mx16 Number of Internal Banks 8
Number of Words per Bank 32M Number of Bits/Word (bit) 16
Data Bus Width (bit) 16 Maximum Clock Rate (MHz) 1866
Address Bus Width (bit) 18 Process Technology CMOS
Minimum Operating Supply Voltage (V) 1.425 Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 156 Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95 Supplier Temperature Grade Commercial
Number of I/O Lines (bit) 16 Mounting Surface Mount
Package Height 0.76 Package Width 7.5
Package Length 13 PCB changed 96
Standard Package Name BGA Supplier Package FBGA
Pin Count ! 96 Lead Shape Ball

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