H5TC4G63CFR-RDI

Name: H5TC4G63CFR-RDI
Rating: 4.5 (10 reviews)

Next-generation memory solution with 256MB capacity, advanced CMOS design, and FBGA-96 pin configuration for reliable performance

6,635 Effective Inventory

H5TC4G63CFR-RDI

Effective Inventory6,635

Next-generation memory solution with 256MB capacity, advanced CMOS design, and FBGA-96 pin configuration for reliable performance

Manufacturer Part # : H5TC4G63CFR-RDI
Brand: Sk Hynix Inc
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H5TC4G63CFR-RDI DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5TC4G63CFR-RDI or email to us: Email: [email protected], we will contact you in 12 hours.

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Details

Introduction to H5TC4G63CFR-RDI

The H5TC4G63CFR-RDI is a high-speed and high-density synchronous graphics RAM (SGRAM) IC manufactured by SK Hynix. This IC is designed for graphic processing units (GPUs), gaming consoles, and high-performance computing applications that require efficient and rapid data access. With its low latency and high data transfer rates, the H5TC4G63CFR-RDI is ideal for accelerating graphics rendering and improving overall system performance in advanced computing platforms.

Specs and Features

Memory Type: Synchronous Graphics RAM (SGRAM) with high-speed data access capabilities.
Density: High-density configuration for storing large amounts of graphical data and textures.
Data Transfer Rate: High-speed data transfer for accelerating graphics processing and system performance.
Low Latency: Minimal delay in data access, ensuring rapid retrieval and processing of graphical data.
Operating Voltage: Supports operating voltages suitable for graphics processing and high-performance computing platforms.
Package Type: Available in compact and industry-standard packages for easy integration into GPU and computing systems.

Application and Uses

The H5TC4G63CFR-RDI is ideal for applications that demand high-speed graphics memory:

Graphics Processing Units (GPUs): Used in dedicated graphics cards and accelerators for enhancing 3D rendering and visual effects.
Gaming Consoles: Integrated into gaming platforms for smooth and responsive gameplay, high-resolution graphics, and immersive experiences.
High-Performance Computing: Applied in supercomputers, data centers, and AI accelerators for rapid data processing and parallel computing tasks.
Virtual Reality (VR) Systems: Utilized in VR headsets and immersive technology platforms for delivering realistic and high-fidelity graphics.

Equivalent Part

For similar functionalities, consider these alternatives to the H5TC4G63CFR-RDI:

MT48LC32M16A2P-75: Synchronous DRAM (SDRAM) IC designed for high-performance graphics and multimedia applications.
GDDR6X: Next-generation graphics memory offering ultra-high data transfer rates and enhanced power efficiency for cutting-edge GPU designs.

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code	Yes	Part Life Cycle Code	Obsolete
Ihs Manufacturer	SK HYNIX INC	Package Description	TFBGA,
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code !	8542.32.00.36	Access Mode !	MULTI BANK PAGE BURST
Additional Feature !	AUTO/SELF REFRESH	JESD-30 Code	R-PBGA-B96
Length	13 mm	Memory Density	4294967296 bit
Memory IC Type	DRAM MODULE	Memory Width	16
Number of Functions	1	Number of Ports !	1
Number of Terminals	96	Number of Words	268435456 words
Number of Words Code	256000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	256MX16	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Peak Reflow Temperature (Cel)	260
Seated Height-Max	1.2 mm	Self Refresh	YES
Supply Voltage-Max (Vsup)	1.45 V	Supply Voltage-Min (Vsup)	1.283 V
Supply Voltage-Nom (Vsup)	1.35 V	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	INDUSTRIAL
Terminal Form !	BALL	Terminal Pitch !	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	7.5 mm