H5TQ4G63EFR-TEC
H5TQ4G63EFR-TEC chip is a high-speedH5TQ4G63EFR-TEC
H5TQ4G63EFR-TEC chip is a high-speed
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Manufacturer Part # : H5TQ4G63EFR-TEC
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Package/Case: BGA
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Brand: SKHYNIX
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Product Categories : DRAMs
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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WireTransfer
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Paypal
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CreditCard
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WesternUnion
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MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
H5TQ4G63EFR-TEC DataSheet
Pricing (USD)
Quantity | Unit Price | Ext. Price |
---|---|---|
1 | $3.856 | $3.86 |
10 | $3.670 | $36.70 |
30 | $3.559 | $106.77 |
100 | $3.448 | $344.80 |
500 | $3.396 | $1,698.00 |
1000 | $3.373 | $3,373.00 |
These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.
Details
H5TQ4G63EFR-TEC is a low power Double Data Rate 4 (LPDDR4) SDRAM manufactured by SK Hynix. It is designed for use in mobile devices such as smartphones, tablets, and laptops. The memory module has a capacity of 4GB and operates at a speed of 4266 Mbps.The H5TQ4G63EFR-TEC features a 1.1 V input/output voltage and a 1.8 V power supply voltage. It supports a x32 organization with a 16-bit I/O interface. The memory module is housed in a 178-ball FBGA package and is RoHS compliant.With its low power consumption and high data transfer rate, the H5TQ4G63EFR-TEC is ideal for use in portable devices that require fast and efficient memory performance. Its compact size and energy efficiency make it a suitable choice for manufacturers looking to create slim and lightweight devices with reliable memory capabilities
![H5TQ4G63EFR-TEC H5TQ4G63EFR-TEC](/files/uploads/product/b/9202edb4-695b-47de-3245-08dbc6589f20.webp)
Key Features
- 4Gb LPDDR4 Mobile DRAM
- Low power consumption
- High-speed operation
- Operates at 1866MHz
- 1.1V power supply
- 64ms refresh period
- JEDEC standard compliant
- Package size: 10mm x 10.5mm
Application
- Smartphones
- Tablets
- Digital cameras
- Portable gaming devices
- Automotive electronics
- Virtual reality devices
- Internet of Things (IoT) devices
- Embedded systems
- Industrial applications
- Medical devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.36 | Access Mode ! | MULTI BANK PAGE BURST |
Additional Feature ! | AUTO/SELF REFRESH | JESD-30 Code | R-PBGA-B96 |
Length | 13 mm | Memory Density | 4294967296 bit |
Memory IC Type | DDR3 DRAM | Memory Width | 16 |
Number of Functions | 1 | Number of Ports ! | 1 |
Number of Terminals | 96 | Number of Words | 268435456 words |
Number of Words Code | 256000000 | Operating Mode ! | SYNCHRONOUS |
Operating Temperature-Max | 95 °C | Operating Temperature-Min | |
Organization | 256MX16 | Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | OTHER |
Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 7.5 mm |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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