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K3QF3F30BM-FGCF
16Gbit memory capacity
K3QF3F30BM-FGCF
16Gbit memory capacity
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Manufacturer Part # : K3QF3F30BM-FGCF
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Package/Case: FBGA
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Part Status : ACTIVE
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Brand: Samsung Electronics
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Product Categories : Memory
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RoHS:
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
WireTransfer
Paypal
CreditCard
WesternUnion
MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
K3QF3F30BM-FGCF DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The product code K3QF3F30BM-FGCF signifies a particular model or part number that is likely associated with a semiconductor product, potentially a digital integrated circuit. The alphanumeric code offers specific details about the technology, design, and specifications of the component. The prefix "K3" may indicate the manufacturer or product family, while "QF3F30BM" likely represents core features like memory capacity and data processing capabilities. Furthermore, the suffix "FGCF" may denote additional characteristics related to packaging type, temperature range, or other specialized features
Key Features
- High-speed data transfer
- Compact design for mobile devices
- Wide operating temperature range
Application
- Low-power memory solution
- High-performance memory
- Memory for enterprise servers
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| ECCN (US) | EAR99 | Part Status ! | Active |
| HTS | 8542.32.00.36 | Automotive | No |
| PPAP | No | DRAM Type | Mobile LPDDR3 SDRAM |
| Chip Density (bit) | 16G | Organization | 256Mx64 |
| Number of Bits/Word (bit) | 64 | Data Bus Width (bit) | 64 |
| Maximum Clock Rate (MHz) | 1866 | Number of I/O Lines (bit) | 64 |
| Mounting | Surface Mount | Package Width | 14 |
| Package Length | 14 | PCB changed | 256 |
| Standard Package Name | BGA | Supplier Package | FBGA |
| Pin Count ! | 256 |
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