K4B2G1646F-BYK0
Get high-speed performance with this DRAM chip, which boasts a capacity of 2Gbit and operates on low voltageK4B2G1646F-BYK0
Get high-speed performance with this DRAM chip, which boasts a capacity of 2Gbit and operates on low voltage
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Manufacturer Part # : K4B2G1646F-BYK0
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Package/Case: FBGA96
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Part Status : OBSOLETE
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Brand: Samsung Electronics
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Product Categories : Memory
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RoHS:
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
K4B2G1646F-BYK0 DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4B2G1646F-BYK0 is a DDR4 SDRAM module produced by Samsung. It has a capacity of 16 gigabits and is organized as 2G x 64 bits. The module operates with a supply voltage of 1.2V and is capable of achieving data transfer rates of up to 3200 Mbps/pin. Designed for use in high-performance computing systems, the K4B2G1646F-BYK0 features a burst length of 8 and has a CAS latency of 22. The module is also equipped with on-die termination (ODT) and supports dynamic refresh with a self-refresh mode. The K4B2G1646F-BYK0 is compliant with the JEDEC standard for DDR4 SDRAM and is designed to be compatible with a wide range of computer systems and devices. It is housed in a 96-ball FBGA package with a size of 78.75mm x 14.25mm x 1.2mm and operates within a temperature range of 0°C to 85°C.
Key Features
- DDR3 SDRAM
- 8Gb capacity
- 1.5V voltage supply
- 800MHz clock speed
- 48-ball FBGA package
- Low power consumption
- RoHS compliant
Application
- Mobile devices
- Tablets
- Portable gaming systems
- Digital cameras
- Automotive infotainment systems
- Industrial applications
- Medical devices
- Networking equipment
- Solid-state drives
- Smart appliances
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
ECCN (US) | EAR99 | Part Status ! | Obsolete |
Automotive | No | PPAP | No |
DRAM Type | DDR3L SDRAM | Chip Density (bit) | 2G |
Organization | 128Mx16 | Number of Internal Banks | 8 |
Number of Words per Bank | 16M | Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 | Maximum Clock Rate (MHz) | 1600 |
Maximum Access Time (ns) | 0.225 | Address Bus Width (bit) | 17 |
Minimum Operating Supply Voltage (V) | 1.283|1.425 | Typical Operating Supply Voltage (V) | 1.35|1.5 |
Maximum Operating Supply Voltage (V) | 1.45|1.575 | Operating Current (mA) | 118 |
Minimum Operating Temperature (°C) | 0 | Maximum Operating Temperature (°C) | 95 |
Supplier Temperature Grade | Commercial | Number of I/O Lines (bit) | 16 |
Mounting | Surface Mount | Package Height | 0.73 |
Package Width | 7.5 | Package Length | 13.3 |
PCB changed | 96 | Standard Package Name | BGA |
Supplier Package | FBGA | Pin Count ! | 96 |
Lead Shape | Ball |
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