FBGA96 Related Product

Part Number Description Brand Lifecycle Status Cargo cycle In Stock Operation
MT41J128M16JT-125 Advanced technology enables faster data transfer rates up to Mbp Micron Technology Inc 3~7 Days 5,053
MT41K512M16HA-125IT:A DRAM DDR3 8G 512MX16 FBGA Micron 3~7 Days 3,626
K4B2G1646Q-BCK0 128MX16 DDR3 DRAM SAMSUNG 3~7 Days 6,030
IS46TR16640B-15GBLA2 Automotive DRAM module ISSI 3~7 Days 7,513
MT40A512M16JY-083E IT:B MT40A512M16JY-083E DDR SDRAM MICRON 3~7 Days 4,893
W631GG6KB-12 This is the description for product W631GG6KB-12 from Winbond Electronics Corporation WINBOND 3~7 Days 6,183
K4B1G1646G-BCH9 Memory Chip DDR3 SDRAM Samsung Electronics OBSOLETE 3~7 Days 9,033
K4B4G0846D-BYK0 High-density memory chip SAMSUNG 3~7 Days 3,968
NT5CB64M16FP-DH Cutting-edge CMOS technology Nanya Technology Corporation 3~7 Days 3,664
H5TQ1G63EFR-PBC Cutting-edge CMOS design for improved performance SKHYNIX 3~7 Days 4,531
W632GU6MB-12 Low-voltage 2Gbit memory module winbond OBSOLETE 3~7 Days 9,552
K4B4G1646E-BMMA Small outline, high-performance RAM module Samsung 3~7 Days 7,033
K4B2G1646F-BMMA 96-pin FBGA Package for DRAM Chip SAMSUNG 3~7 Days 6,002
K4A8G165WB-BCTD The K4A8G165WB-BCTD chip is a versatile solution for various applications requiring high-density memory storage SAMSUNG 3~7 Days 6,718
H5TC4G63CFR-PBA FBGA-96 package Hynix 3~7 Days 6,374
D2516EC4BXGGB DRAM Chip DDR3L SDRAM 4G-Bit 256Mx16 1.35V 96-Pin F-BGA Kingston Technology 3~7 Days 2,000
H5TC4G63AFR-PBA 256MX16, 0.225ns, CMOS SKHYNIX 3~7 Days 3,061
K4B2G1646Q-BYK0 DDR4 SDRAM chip with 8Gb capacity from Samsung. SAMSUNG 3~7 Days 7,163
K4B4G0846A-HCH9 Samsung FBGA96 SAMSUNG 3~7 Days 7,960
D2516EC4BXGGB-U High-speed 1600 MHz Kingston 3~7 Days 2,617
K4B2G1646F-BYK0 Get high-speed performance with this DRAM chip, which boasts a capacity of 2Gbit and operates on low voltage Samsung Electronics OBSOLETE 3~7 Days 6,564
K4A4G165WE-BCTD Model: K4A4G165WE-BCTD, FBGA-96 DRAM ROHS Samsung Electronics ACTIVE 3~7 Days 7,447