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K4B4G0846E-BYK0
Cutting-edge DDR3L DRAM chip, offering a 512MX8 configuration in a compact PBGA78 package, ideal for various memory-intensive applications
K4B4G0846E-BYK0
Cutting-edge DDR3L DRAM chip, offering a 512MX8 configuration in a compact PBGA78 package, ideal for various memory-intensive applications
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Manufacturer Part # : K4B4G0846E-BYK0
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Package/Case: FBGA
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Brand: Samsung Artik
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
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Cut Tape
Tube or Tray
K4B4G0846E-BYK0 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4B4G0846E-BYK0 is a 4Gb DDR4 SDRAM module manufactured by Samsung. It has a storage capacity of 4 gigabits and is organized as a dual-rank module with a total of 8 banks. The module operates at a voltage of 1.2V and supports a maximum clock frequency of 2400MHz.The K4B4G0846E-BYK0 features a x16 configuration, which means it has 16 data lines. This configuration allows for higher bandwidth and faster data transfer rates compared to x8 configurations. The module has a CAS latency of 17, providing a good balance between speed and latency.The module is designed for use in high-performance computing systems, including servers, workstations, and gaming PCs. It is compatible with Intel and AMD platforms that support DDR4 memory, making it a versatile option for a wide range of applications.
Key Features
- 4Gb DDR4 SDRAM
- Organized as 1,024 M x 4bit x 8 banks
- Speeds up to 2400Mbps
- Operating voltage of 1.2V
- Available in FBGA packaging
- Temperature range of 0°C to 95°C
- Row control: RA / CAS Control: CA0, CA1 / BA1
Application
- Consumer electronics: used in smartphones, tablets, and laptops
- Automotive industry: for applications in infotainment systems and driver assistance systems
- Industrial applications: such as robotics, automation, and control systems
- Medical devices: in equipment like monitoring systems and imaging devices
- Telecommunications: for network infrastructure and communication devices
- Military and aerospace: in high-reliability applications
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| ECCN (US) | EAR99 | Part Status ! | LTB |
| HTS | 8542.32.00.36 | Automotive | No |
| PPAP | No | DRAM Type | DDR3L SDRAM |
| Chip Density (bit) | 4G | Organization | 512Mx8 |
| Number of Internal Banks | 8 | Number of Words per Bank | 64M |
| Number of Bits/Word (bit) | 8 | Data Bus Width (bit) | 8 |
| Maximum Clock Rate (MHz) | 1600 | Maximum Access Time (ns) | 0.225 |
| Address Bus Width (bit) | 19 | Minimum Operating Supply Voltage (V) | 1.283|1.425 |
| Typical Operating Supply Voltage (V) | 1.35|1.5 | Maximum Operating Supply Voltage (V) | 1.45|1.575 |
| Operating Current (mA) | 71 | Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 | Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 8 | Mounting | Surface Mount |
| Package Width | 7.5 | Package Length | 11 |
| PCB changed | 78 | Standard Package Name | BGA |
| Supplier Package | FBGA | Pin Count ! | 78 |
| Lead Shape | Ball |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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