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K4S281632O-LC75
The K4S281632O-LC75 chip is a high-speed, low-power Synchronous Dynamic Random Access Memory (SDRAM) component used in various electronic devicesK4S281632O-LC75
The K4S281632O-LC75 chip is a high-speed, low-power Synchronous Dynamic Random Access Memory (SDRAM) component used in various electronic devices
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We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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K4S281632O-LC75 DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4S281632O-LC75 is a synchronous dynamic random-access memory (SDRAM) chip manufactured by Samsung Electronics. It has a capacity of 256 megabytes (MB) and operates at a clock frequency of 133 MHz. The chip is organized as a 4Mx16 configuration, meaning it has 4 million cells with each cell storing 16 bits of data.The K4S281632O-LC75 features a low 7.5ns access time, which allows for fast data retrieval and processing. It also operates at a low voltage of 3.3V, making it energy-efficient and suitable for use in a variety of devices.This SDRAM chip is designed for use in computer systems, networking equipment, and other devices that require high-speed and efficient memory performance. It is compatible with a range of memory controllers and supports burst mode, allowing for rapid data transfer.
Key Features
- 64M x 1 bit x 4 banks synchronous DRAM
- High-speed data transfer rates up to 133 MHz
- Low power consumption
- Operates from a +3.3V (± 0.3V) power supply
- Programmable CAS latency of 2, 3 clocks
- Internal pipelined operation
Application
- Mobile devices
- Smartphones
- Tablets
- Digital cameras
- MP3 players
- GPS systems
- Handheld gaming devices
- Automotive infotainment systems
- Industrial equipment
- Medical devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code ! | 8542.32.00.02 | Access Time-Max | 5.4 ns |
| Clock Frequency-Max (fCLK) | 133 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 1,2,4,8 | JESD-30 Code | R-PDSO-G54 |
| JESD-609 Code | e6 | Memory Density | 134217728 bit |
| Memory IC Type | SYNCHRONOUS DRAM | Memory Width | 16 |
| Moisture Sensitivity Level | 3 | Number of Terminals | 54 |
| Number of Words | 8388608 words | Number of Words Code | 8000000 |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
| Organization | 8MX16 | Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY | Package Code | TSOP |
| Package Equivalence Code | TSOP54,.46,32 | Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE | Peak Reflow Temperature (Cel) | 260 |
| Power Supplies ! | 3.3 V | Qualification Status ! | Not Qualified |
| Refresh Cycles | 4096 | Sequential Burst Length | 1,2,4,8,FP |
| Standby Current-Max | 0.002 A | Supply Current-Max | 0.06 mA |
| Supply Voltage-Nom (Vsup) | 3.3 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | OTHER |
| Terminal Finish | TIN BISMUTH | Terminal Form ! | GULL WING |
| Terminal Pitch ! | 0.8 mm | Terminal Position | DUAL |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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