K4S561632J-UC75

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Compact 54-pin Thin Small Outline Package (TSOP-II) design, suitable for use in a variety of electronic devices

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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K4S561632J-UC75 DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for K4S561632J-UC75 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

Samsung's K4S561632J-UC75 SDRAM module is designed to meet the demands of modern computing. Boasting a CAS latency of 3, this module minimizes delays in data retrieval, enhancing overall system performance. The burst read and write operations supported by this module ensure quick data access, making it a valuable addition to any system requiring high-speed memory solutions

K4S561632J-UC75

Key Features

  • Operates at 2.5V voltage level
  • Available in TSOP and FBGA packages
  • Features burst length control
  • Promotes efficient data transfer
  • Maintains CAS latency flexibility

Application

  • Speeds up data retrieval
  • Optimizes system efficiency
  • Maximizes device potential

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Reach Compliance Code
ECCN Code EAR99 HTS Code ! 8542.32.00.24
Access Time-Max 5.4 ns Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PDSO-G54 JESD-609 Code e6
Memory Density 268435456 bit Memory IC Type SYNCHRONOUS DRAM
Memory Width 16 Moisture Sensitivity Level 2
Number of Terminals 54 Number of Words 16777216 words
Number of Words Code 16000000 Operating Temperature-Max 70 °C
Operating Temperature-Min Organization 16MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TSOP Package Equivalence Code TSOP54,.46,32
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260 Power Supplies ! 3.3 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Sequential Burst Length 1,2,4,8,FP Standby Current-Max 0.002 A
Supply Current-Max 0.12 mA Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Finish TIN BISMUTH
Terminal Form ! GULL WING Terminal Pitch ! 0.8 mm
Terminal Position DUAL

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification K4S561632J-UC75 PDF Download

FAQs

What is K4S561632J-UC75?

The K4S561632J-UC75 is a 512M bit DDR SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory) module designed and manufactured by Samsung. It is commonly used in computer systems, networking equipment, and other digital devices that require high-speed memory for data storage and processing.

How Does K4S561632J-UC75 Work?

The K4S561632J-UC75 works by providing high-speed access to stored data and allowing for simultaneous reading and writing operations. With its double data rate feature, the module transfers data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate compared to traditional SDRAM.

How Many Pins does K4S561632J-UC75 have and What are the Functions of the Pinout Configuration?

The K4S561632J-UC75 is typically available in a 66-pin TSOP (Thin Small Outline Package) form factor. The pinout configuration includes:

  • DQ: Data input/output pins for bi-directional communication.
  • CLK: Clock input pin for synchronization.
  • CS: Chip select pin for device activation.
  • WE: Write enable pin for initiating write operations.
  • CAS, RAS: Column address strobe and row address strobe pins for memory access control.
  • BA0-BA1: Bank address pins for selecting memory bank.
  • DM: Data mask pins for write operation masking.
  • VDD, VSS: Power supply and ground pins, respectively.

What are the Pros and Cons of K4S561632J-UC75?

Pros:

  • High Data Transfer Rate: Provides high-speed data transfer for improved system performance.
  • Low Power Consumption: Operates with low power consumption, making it energy-efficient.
  • Industry Standard: Conforms to industry-standard SDRAM specifications for compatibility.
  • High Density: Offers a large memory capacity for data storage and processing.

Cons:

  • Complex Interface: Requires careful timing and control signals for proper operation.
  • Signal Integrity: Susceptible to signal integrity issues if not carefully designed into the system.
  • Compatibility Requirements: May require specific controller support and system design considerations for optimal performance.

Are There Any Equivalents/Alternatives to K4S561632J-UC75 for Recommendation?

  • Equivalent parts to the K4S561632J-UC75 include the MT47H64M16HR-25E:H from Micron and the IS42S16160J-7TLI from Integrated Silicon Solution, Inc. (ISSI).
  • Alternatives to the K4S561632J-UC75 include the H5TC4G63AFR-PBA from SK Hynix and the W971GG6JB-25 from Winbond.

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