K4T51163QG-HCE6000
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA T/RK4T51163QG-HCE6000
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin FBGA T/R
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Manufacturer Part # : K4T51163QG-HCE6000
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Package/Case: FBGA
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Part Status : OBSOLETE
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Brand: Samsung Electronics
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Product Categories : Memory
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RoHS:
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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WireTransfer
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Paypal
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CreditCard
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WesternUnion
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MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
K4T51163QG-HCE6000 DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4T51163QG-HCE6000 is a DDR4 SDRAM module manufactured by Samsung. It is a 8-gigabit dynamic random-access memory module organized as a 512Mbit x 16 I/O configuration. The module operates at a voltage of 1.2V and has a maximum clock frequency of 3000 MHz. With a CAS latency of 17, this module offers high-speed data transfer rates for demanding applications.The K4T51163QG-HCE6000 is designed for use in high-performance computing systems, workstations, servers, and other applications that require fast and reliable memory. It is compliant with JEDEC standards and has been thoroughly tested to ensure compatibility and reliability.Featuring a x16 organization, this module can deliver fast data transfer rates and improved performance in multitasking environments. The module also supports various power-saving features that help reduce energy consumption without compromising performance.
Key Features
- Part number: K4T51163QG-HCE6000
- Type: DDR3 SDRAM
- Memory size: 4Gb
- Organization: 512M x 8
- Data transfer rate: 6000 Mbps
- Voltage: 1.5V
- Package: 96-ball FBGA
- Operating temperature: 0°C to 95°C
Application
- Mobile phones
- Tablets
- Laptops
- Digital cameras
- Portable gaming devices
- Networking equipment
- Automotive infotainment systems
- Industrial automation
- Medical devices
- Smart home devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
ECCN (US) | EAR99 | Part Status ! | Obsolete |
Automotive | No | PPAP | No |
DRAM Type | DDR2 SDRAM | Chip Density (bit) | 512M |
Organization | 32Mx16 | Number of Internal Banks | 4 |
Number of Words per Bank | 8M | Number of Bits/Word (bit) | 16 |
Data Bus Width (bit) | 16 | Maximum Clock Rate (MHz) | 667 |
Maximum Access Time (ns) | 0.45 | Address Bus Width (bit) | 15 |
Interface Type | SSTL_18 | Minimum Operating Supply Voltage (V) | 1.7 |
Maximum Operating Supply Voltage (V) | 1.9 | Operating Current (mA) | 165 |
Minimum Operating Temperature (°C) | 0 | Maximum Operating Temperature (°C) | 95 |
Supplier Temperature Grade | Commercial | Number of I/O Lines (bit) | 16 |
Packaging ! | Tape and Reel | Mounting | Surface Mount |
Package Height | 0.95 | Package Width | 7.5 |
Package Length | 12.5 | PCB changed | 84 |
Standard Package Name | BGA | Supplier Package | FBGA |
Pin Count ! | 84 | Lead Shape | Ball |
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