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NLV27WZ16DFT2G
6-Pin Non-Inverting CMOS Buffer
NLV27WZ16DFT2G
6-Pin Non-Inverting CMOS Buffer
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
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NLV27WZ16DFT2G DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
Leveraging state-of-the-art technology, the NLV27WZ16DFT2G chip offers unparalleled performance in the realm of wireless communication and networking applications. Equipped with a sophisticated design, this integrated circuit delivers exceptional efficiency, combining minimal power usage with high-speed data transmission capabilities. As a versatile solution for demanding tasks, the NLV27WZ16DFT2G chip is poised to enhance the functionality and reliability of systems requiring prompt and efficient data handling
Key Features
- Suitable for High-Speed Applications
- Low Power Consumption Reduces Heat Generation
- Nominal Operating Voltage: 3.3 V ±10%
- Balanced Output Drive Capability
- Supports Industrial and Automotive Environments
- RoHS Compliant Packages Available
Application
- Drive innovation forward
- Evolve with the industry
- Adapt to changing landscapes
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Pbfree Code | Yes | Part Life Cycle Code | Active |
| Part Package Code | SC-88/SC70-6/SOT-363 6 LEAD | Pin Count ! | 6 |
| Reach Compliance Code | compliant | HTS Code ! | 8542.39.00.01 |
| Family | LVC/LCX/Z | JESD-30 Code | R-PDSO-G6 |
| JESD-609 Code | e3 | Length | 2 mm |
| Load Capacitance (CL) | 50 pF | Logic IC Type | BUFFER |
| Max I(ol) | 0.032 A | Moisture Sensitivity Level | 1 |
| Number of Functions | 2 | Number of Inputs | 1 |
| Number of Terminals | 6 | Operating Temperature-Max | 125 °C |
| Operating Temperature-Min | -55 °C | Package Body Material | PLASTIC/EPOXY |
| Package Code | TSSOP | Package Equivalence Code | TSSOP6,.08 |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR | Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 100 mA | Propagation Delay (tpd) | 10.2 ns |
| Qualification Status ! | Not Qualified | Schmitt Trigger | NO |
| Screening Level | AEC-Q100 | Seated Height-Max | 1.1 mm |
| Supply Voltage-Max (Vsup) | 5.5 V | Supply Voltage-Min (Vsup) | 1.65 V |
| Supply Voltage-Nom (Vsup) | 2.3 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | MILITARY |
| Terminal Finish | MATTE TIN | Terminal Form ! | GULL WING |
| Terminal Pitch ! | 0.65 mm | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | Width | 1.25 mm |
| Series | 27WZ | Product Status | Obsolete |
| Logic Type | Buffer, Non-Inverting | Number of Elements | 2 |
| Number of Bits per Element | 1 | Output Type | Push-Pull |
| Current - Output High, Low | 32mA, 32mA | Voltage - Supply | 1.65V ~ 5.5V |
| Operating Temperature ! | -55°C ~ 125°C (TA) | Grade | Automotive |
| Qualification | AEC-Q100 | Mounting Type | Surface Mount |
| Package / Case | 6-TSSOP, SC-88, SOT-363 | Supplier Device Package | SC-88/SC70-6/SOT-363 |
| Base Product Number | 27WZ16 |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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