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W25Q64FVBYIQ
MX8, pbga16, wlcsp-16
W25Q64FVBYIQ
MX8, pbga16, wlcsp-16
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Manufacturer Part # : W25Q64FVBYIQ
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Package/Case: BGA16
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Brand: WINBOND
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Product Categories : Microcontrollers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
WireTransfer
Paypal
CreditCard
WesternUnion
MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
W25Q64FVBYIQ DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The W25Q64FVBYIQ is a high-performance, low-power 64Mb serial flash memory chip produced by Winbond. It features a high-speed SPI interface with a clock frequency of up to 104MHz, making it ideal for applications that require fast read and write operations.This flash memory chip offers a large storage capacity of 64Mb (8MB) organized into 8,192 pages of 256 bytes each. It also supports flexible erase options, including sector, block, and chip erase functions. The W25Q64FVBYIQ operates over a wide voltage range from 2.7V to 3.6V, making it compatible with a variety of devices and systems.In addition, this flash memory chip is designed with advanced security features, such as a hardware-controlled write protection mechanism and a unique ID feature for device authentication. It also includes a multi-I/O interface for increased data transfer rates and improved system performance.
Key Features
- 64M-bit serial flash memory
- Wide operating voltage range: 2.3V to 3.6V
- High-speed clock frequency up to 104MHz
- Low power consumption
- Uniform 4KB sectors with dual/quad SPI support
- Over 100,000 erase/program cycles per sector
Application
- Consumer electronics
- Networking equipment
- Industrial applications
- Automotive systems
- Medical devices
- Security systems
- Gaming consoles
- IoT devices
- Printers and scanners
- Data storage systems
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
| Rohs Code | Yes | Part Life Cycle Code | Not Recommended |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code ! | 8542.32.00.51 | Alternate Memory Width | 1 |
| Clock Frequency-Max (fCLK) | 104 MHz | Data Retention Time-Min | 20 |
| JESD-30 Code | R-PBGA-B16 | Length | 3.405 mm |
| Memory Density | 67108864 bit | Memory IC Type | FLASH |
| Memory Width | 8 | Number of Functions | 1 |
| Number of Terminals | 16 | Number of Words | 8388608 words |
| Number of Words Code | 8000000 | Operating Mode ! | SYNCHRONOUS |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
| Organization | 8MX8 | Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY | Package Code | VFBGA |
| Package Equivalence Code | BGA16,4X4,32/20 | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Parallel/Serial | SERIAL |
| Seated Height-Max | 0.512 mm | Serial Bus Type | SPI |
| Standby Current-Max | 0.00005 A | Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V | Surface Mount ! | YES |
| Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
| Terminal Form ! | GULL WING | Terminal Pitch ! | 0.8 mm |
| Terminal Position | BOTTOM | Width | 2.335 mm |
| Write Protection | HARDWARE/SOFTWARE |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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