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Specification Comparison: W25Q64FVSIQ vs W25Q64FVZEIG vs W25Q64FVBYIQ
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| Manufacturer | WINBOND | Winbond | WINBOND |
| Package | SOP8 | WSON EP | BGA16 |
| Description | Flash memory chip with 64Mb capacity and SPI interface for data storage. | Advanced storage solution for high-speed applications requiring low power consumption | MX8, pbga16, wlcsp-16 |
| Stock | 3138 | 7949 | 5569 |
| Product Category | IC Chips | NOR Flash | |
| Brand | Winbond | ||
| Product Type | NOR Flash | ||
| Subcategory | Memory & Data Storage | ||
| Rohs Code | Yes | ||
| Part Life Cycle Code | Not Recommended | ||
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.51 | ||
| Alternate Memory Width | 1 | ||
| Clock Frequency-Max (fCLK) | 104 MHz | ||
| Data Retention Time-Min | 20 | ||
| JESD-30 Code | R-PBGA-B16 | ||
| Length | 3.405 mm | ||
| Memory Density | 67108864 bit | ||
| Memory IC Type | FLASH | ||
| Memory Width | 8 | ||
| Number of Functions | 1 | ||
| Number of Terminals | 16 | ||
| Number of Words | 8388608 words | ||
| Number of Words Code | 8000000 | ||
| Operating Mode | SYNCHRONOUS | ||
| Operating Temperature-Max | 85 °C | ||
| Operating Temperature-Min | -40 °C | ||
| Organization | 8MX8 | ||
| Output Characteristics | 3-STATE | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | VFBGA | ||
| Package Equivalence Code | BGA16,4X4,32/20 | ||
| Package Shape | RECTANGULAR | ||
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | ||
| Parallel/Serial | SERIAL | ||
| Seated Height-Max | 0.512 mm | ||
| Serial Bus Type | SPI | ||
| Standby Current-Max | 0.00005 A | ||
| Supply Voltage-Max (Vsup) | 3.6 V | ||
| Supply Voltage-Min (Vsup) | 3 V | ||
| Surface Mount | YES | ||
| Technology | CMOS | ||
| Temperature Grade | INDUSTRIAL | ||
| Terminal Form | GULL WING | ||
| Terminal Pitch | 0.8 mm | ||
| Terminal Position | BOTTOM | ||
| Width | 2.335 mm | ||
| Write Protection | HARDWARE/SOFTWARE |
Part Number
Start with: W25Q6
Part Number "W25Q6" returned 21 results; all results matched and started with "W25Q6".
| Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|---|
| W25Q64BVSSIG |
MX8 capacity and PDSO8 package |
Winbond | 8-SOIC | Obsolete | 3~7 Days | 4,370.00 | |
| W25Q64BVSFIG |
16 package, Plastic casing in green, 8 megabytes by 8 bits Flash memory |
Winbond | 16-SOIC | 3~7 Days | 3,542.00 | ||
| W25Q64CVSSIG |
Flash memory chip |
Winbond Electronics | SOP-8 | Obsolete | 3~7 Days | 3,634.00 | |
| W25Q64FVSFIG |
Wide range of applications and compatibility |
Winbond Electronics | SOIC-16 | Obsolete | 3~7 Days | 5,443.00 | |
| W25Q64JVSSIG |
Operates at either 3V or 3.3V voltage levels |
WINBOND | SOP-8 | 3~7 Days | 5,943.00 | ||
| W25Q64FVSIG |
The W25Q64FVSIG is a high-performance, serial flash memory chip with a capacity of 64Mb |
WINBOND | SOP-8 | 3~7 Days | 5,631.00 | ||
| W25Q64FVAIG |
The W25Q64FVAIG is a high-performance 64Mb serial flash memory chip manufactured by Winbond |
WINBOND | DIP-8 | 3~7 Days | 3,639.00 | ||
| W25Q64BVSIG |
The W25Q64BVSIG is a 64Mb serial flash memory chip from Winbond |
WINBOND | SOP-8 | 3~7 Days | 5,943.00 | ||
| W25Q64FWSSIG |
The W25Q64FWSSIG is a 1.8V NOR flash memory module with a capacity of 64M-bit |
Winbond Electronics | SOIC-8 | OBSOLETE | 3~7 Days | 6,501.00 | |
| W25Q64CVSFIG |
8MX8 SPI NAND Flash |
Winbond | 16-SOIC | 3~7 Days | 4,709.00 | ||
| W25Q64FVZPIG |
The W25Q64FVZPIG is a high-speed flash memory chip suitable for a variety of applications |
Winbond Electronics | WDFN-8 | 3~7 Days | 7,562.00 | ||
| W25Q64FVZPIQ |
4 megabits by 1, package outline with 8 pins, no lead with dual flat - 8 |
Winbond Electronics | WDFN-8 | 3~7 Days | 3,922.00 | ||
| W25Q64JWSSIQ |
High-speed data transfer |
Winbond Electronics | SOIC-8 | 3~7 Days | 7,240.00 | ||
| W25Q64JVZPIQ TR |
NOR Flash spiFlash |
Winbond Electronics | WSON-8 | Active | 3~7 Days | 7,289.00 | |
| W25Q64DWSSIG |
W25Q64DWSSIG is a flash memory chip with a capacity of 256KX32 and a fast access time of 7.5ns |
WINBOND | SOIC-8 | Obsolete | 3~7 Days | 7,341.00 | |
| W25Q64BVZEIG |
Ultra-fast storage solution for modern electroni |
Winbond Electronics | WDFN-8 | 3~7 Days | 7,696.00 | ||
| W25Q64JWSSIM |
Product W25Q64JWSSIM |
WINBOND | SOP8 | 3~7 Days | 3,875.00 | ||
| W25Q64JVSSAQ |
64Mbit SPI NOR Flash Memory IC with Quad I/O Interface |
WINBOND | WSOP8 | 3~7 Days | 7,369.00 | ||
| W25Q64JVXGIM |
W25Q64JVXGIM is a 64M-bit serial flash memory chip. |
WINBOND | XSON-84x4mm | 3~7 Days | 3,568.00 | ||
| W25Q64FWSIQ |
W25Q64FWSIQ is a 64Mb serial flash memory chip with a quad SPI interface. |
WINBOND | WSOP-8 | 3~7 Days | 6,482.00 | ||
| W25Q64FVIG |
W25Q64FVIG is a 64Mb serial flash memory chip with a flexible architecture. |
WINBOND | SON8 | 3~7 Days | 4,027.00 |