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Specification Comparison: MT40A2G8VA-062E:B vs MT40A2G4SA-075:E vs MT40A2G8SA-062E:F
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| Manufacturer | Micron Technology | MICRON TECHNOLOGY INC | Micron Technology |
| Package | FBGA-78 | FBGA-78 | TFBGA-78 |
| Description | Upgrade your system's memory capacity with the reliable MT40A2G8VA-062E:B DDR4 Z22A 16Gb module." | Designed for high performance and efficiency, the MT40A2G4SA-075:E chip is ideal for various memory-intensive applications | 1.2V 16Gbit DDR4 SDRAM Chip |
| Stock | 5030 | 9429 | 18000 |
| Organization | 2 G x 8 | 2GX4 | 2 G x 8 |
| Product Category | DRAM | DRAM | |
| RoHS | Details | Details | |
| Type | SDRAM - DDR4 | SDRAM - DDR4 | |
| Mounting Style | SMD/SMT | SMD/SMT | |
| Package / Case | FBGA-78 | FBGA | |
| Memory Size | 16 Gbit | 16 Gbit | |
| Brand | Micron | Micron | |
| Moisture Sensitive | Yes | Yes | |
| Product Type | DRAM | DRAM | |
| Factory Pack Quantity | 1520 | 1260 | |
| Subcategory | Memory & Data Storage | Memory & Data Storage | |
| Data Bus Width | 8 bit | ||
| Supply Voltage - Max | 1.26 V | ||
| Supply Voltage - Min | 1.14 V | ||
| Minimum Operating Temperature | 0 C | ||
| Maximum Operating Temperature | + 95 C | ||
| Series | MT40A | ||
| Part Life Cycle Code | End Of Life | ||
| Ihs Manufacturer | MICRON TECHNOLOGY INC | ||
| Package Description | TFBGA, | ||
| Reach Compliance Code | compliant | ||
| ECCN Code | EAR99 | ||
| HTS Code | 8542.32.00.36 | ||
| Factory Lead Time | 53 Weeks, 1 Day | ||
| Date Of Intro | 2017-07-13 | ||
| Samacsys Manufacturer | Micron | ||
| Access Mode | MULTI BANK PAGE BURST | ||
| Additional Feature | AUTO/SELF REFRESH | ||
| I/O Type | COMMON | ||
| Interleaved Burst Length | 8 | ||
| JESD-30 Code | R-PBGA-B78 | ||
| JESD-609 Code | e1 | ||
| Length | 11 mm | ||
| Memory Density | 8589934592 bit | ||
| Memory IC Type | DDR4 DRAM | ||
| Memory Width | 4 | ||
| Number of Functions | 1 | ||
| Number of Ports | 1 | ||
| Number of Terminals | 78 | ||
| Number of Words | 2147483648 words | ||
| Number of Words Code | 2000000000 | ||
| Operating Mode | SYNCHRONOUS | ||
| Operating Temperature-Max | 95 °C | ||
| Package Body Material | PLASTIC/EPOXY | ||
| Package Code | TFBGA | ||
| Package Equivalence Code | BGA78,6X13,32 | ||
| Package Shape | RECTANGULAR | ||
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | ||
| Peak Reflow Temperature (Cel) | 260 | ||
| Refresh Cycles | 65536 | ||
| Reverse Pinout | NO | ||
| Seated Height-Max | 1.2 mm | ||
| Self Refresh | YES | ||
| Supply Voltage-Max (Vsup) | 1.26 V | ||
| Supply Voltage-Min (Vsup) | 1.14 V | ||
| Supply Voltage-Nom (Vsup) | 1.2 V | ||
| Surface Mount | YES | ||
| Technology | CMOS | ||
| Temperature Grade | OTHER | ||
| Terminal Finish | TIN SILVER COPPER | ||
| Terminal Form | BALL | ||
| Terminal Pitch | 0.8 mm | ||
| Terminal Position | BOTTOM | ||
| Time@Peak Reflow Temperature-Max (s) | 30 | ||
| Width | 7.5 mm |
Part Number
Start with: MT40A
Part Number "MT40A" returned 22 results; all results matched and started with "MT40A".
| Part Number | Description | Brand | Package/Case | Lifecycle Status | Cargo cycle | In Stock | Operation |
|---|---|---|---|---|---|---|---|
| MT40A1G8WE-083E:B |
High-density memory component |
Micron Technology | FBGA | 3~7 Days | 6,491.00 | ||
| MT40A256M16GE-083E:B |
DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA |
Micron Technology | BGA | Obsolete | 3~7 Days | 6,038.00 | |
| MT40A1G16RC-062E:B |
Top-of-the-line DDR4 Z22A memory module |
Micron Technology | FBGA-96 | Obsolete | 3~7 Days | 3,096.00 | |
| MT40A2G8VA-062E IT:B |
Enhance your computer's performance with the Microchip Technology DDR4 16GB 2GX8 FBGA memory module |
Microchip Technology | FBGA | ACTIVE | 3~7 Days | 4,273.00 | |
| MT40A512M8RH-083E:B |
DDR DRAM 512MX8 |
Micron Technology | FBGA-78 | OBSOLETE | 3~7 Days | 5,802.00 | |
| MT40A1G8WE-075E:D |
Also known as Fully-Buffered DIMM (FB-DIMM) |
MICRON | 78-TFBGA | 3~7 Days | 7,091.00 | ||
| MT40A256M16LY-062E:F |
High-speed 4 Gbit RAM |
MICRON | 96-TFBGA | 3~7 Days | 7,445.00 | ||
| MT40A512M16JY-083E IT:B |
MT40A512M16JY-083E DDR SDRAM |
MICRON | FBGA96 | 3~7 Days | 4,893.00 | ||
| MT40A1G8WE-083E IT:B |
English expressions |
MICRON | BGA-78 | 3~7 Days | 7,761.00 | ||
| MT40A512M16JY-083E AIT:B |
High-density 512MX16 FBGA RAM |
MICRON | 96-TFBGA | 3~7 Days | 5,317.00 | ||
| MT40A512M16LY-062E AIT:E |
High-density memory module |
MICRON | 96-TFBGA | 3~7 Days | 4,082.00 | ||
| MT40A512M16JY-083E AUT:B |
FBGA package configuration |
Micron Technology | FBGA | 3~7 Days | 7,680.00 | ||
| MT40A512M16TB-062E IT:J |
Parallel 96FBGA IC DRAM 8Gbit |
MICRON | 96-TFBGA | 3~7 Days | 7,944.00 | ||
| MT40A1G8SA-062E:J |
8 Gigabit capacity |
Micron Technology | FBGA-78 | 3~7 Days | 7,613.00 | ||
| MT40A256M16LY-062E AIT:F |
Next-generation DRAM component for improved performance |
MICRON | 96-TFBGA | NRND | 3~7 Days | 3,274.00 | |
| MT40A256M16LY-062E IT:F |
DDRRAM module featuring x configuratio |
MICRON | 96-TFBGA | 3~7 Days | 5,920.00 | ||
| MT40A512M8RH-083E IT:B |
High-density DDR4 SDRAM |
MICRON | 78-TFBGA | 3~7 Days | 3,789.00 | ||
| MT40A1G16HBA-083E:A |
DDR DRAM memory module |
Micron Technology | FBGA-96 | 3~7 Days | 3,011.00 | ||
| MT40A256M16GE-075E:B |
MT40A256M16GE-075E:B DDR4 4G 256MX16 FBGA DRAM |
Micron Technology | FBGA-96 | OBSOLETE | 3~7 Days | 6,191.00 | |
| MT40A256M16GE-062E:B |
Efficiently designed to enhance overall system reliabilit |
MICRON | 96-TFBGA | OBSOLETE | 3~7 Days | 6,119.00 | |
| MT40A256M16GE-075E IT:B |
4Gb 1.2V 96-Pin FBGA |
Micron Technology | FBGA | 3~7 Days | 346.00 | ||
| MT40A512M16TD-062E AAT:R TR |
MT40A512M16TD-062E AAT:R TR,'Advanced DDR4 RAM module for improved system performance |
Micron | TFBGA-96 | 3~7 Days | 7,643.00 |