BGA7027

Effective Inventory6,056

400 MHz to 2700 MHz frequency range

  • Manufacturer Part # : BGA7027

  • Package/Case: SOT-89

  • Brand: NXP

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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WireTransfer

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Paypal

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CreditCard

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WesternUnion

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MoneyGram

Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

BGA7027 DataSheet

no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for BGA7027 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

BGA7027 is a ball grid array (BGA) package with a 7027-pin count. It is commonly used in high-performance applications such as graphics processing units (GPUs), central processing units (CPUs), and application-specific integrated circuits (ASICs).The package size of BGA7027 is typically around 45mm x 45mm, with a pitch of 1.0mm. This means that the distance between the centers of adjacent balls is 1.0mm, providing a high density of connections in a compact form factor.BGA7027 packages typically use solder balls for attachment to the printed circuit board (PCB). These solder balls provide a reliable and robust connection, especially in applications where high thermal and mechanical stresses are present.BGA7027 packages are known for their excellent thermal performance due to the large number of connections between the package and the PCB. This allows for efficient heat dissipation, which is crucial for maintaining the reliability and performance of high-power electronic components.In summary, BGA7027 is a high-pin count BGA package commonly used in high-performance electronic applications. It offers a compact form factor, reliable connection method, and excellent thermal performance, making it a popular choice for advanced electronic devices

Key Features

  • Flashless ADM for ultra-low power consumption
  • Integrated I2C and SPI interface
  • Intelligent power management for maximum efficiency
  • Programmable gain amplifier for flexible signal processing

Application

  • Wireless communication systems
  • Mobile devices
  • Satellite communication systems
  • Radar systems
  • Industrial controls
  • Automotive systems
  • Medical equipment
  • Aerospace applications
  • Security systems
  • Remote monitoring systems

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

isReqSample true salesNum BGA7027,135
leadTime 99 requaestItemType REQUEST_SAMPLE
pack_type REEL pack_desc Reel 11¼" Q1/T1 in LargePack
minPackQty 4000 status End of Life

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification BGA7027 PDF Download

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