H5TC8G63AMR-PBA
The H5TC8G63AMR-PBA chip is a DDR4 SDRAM module commonly used in computing devicesH5TC8G63AMR-PBA
The H5TC8G63AMR-PBA chip is a DDR4 SDRAM module commonly used in computing devices
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Manufacturer Part # : H5TC8G63AMR-PBA
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Package/Case: FBGA-96
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Brand: SKHYNIX
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Product Categories : DRAMs
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
H5TC8G63AMR-PBA DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The H5TC8G63AMR-PBA is a DDR4 SDRAM module manufactured by SK Hynix. It features a capacity of 8 gigabits (Gb), organized as 1G x 8 bits, which translates to 1 gigabyte (GB) per chip. The module operates at a standard voltage of 1.2V and supports data transfer rates up to 3200 Mbps. It utilizes a FBGA (Fine-pitch Ball Grid Array) package, ensuring efficient space utilization on the circuit board. With a CAS latency of CL22, it provides decent performance for various computing tasks. The H5TC8G63AMR-PBA is commonly used in desktop computers, laptops, and other electronic devices requiring reliable and high-speed memory. Its compact form factor and low power consumption make it suitable for a wide range of applications, including gaming, multimedia editing, and enterprise computing
![H5TC8G63AMR-PBA H5TC8G63AMR-PBA](/files/uploads/product/b/c211dcc4-213d-4910-465b-08dbc6589f20.webp)
Key Features
- 8 Gb DDR4 SDRAM
- High-speed data transfer rates
- Low power consumption
- 4.266 Gbps/pin data transfer rate
- Operates at 1.2V power supply
- 77-ball FBGA package
Application
- Mobile devices
- Computing systems
- Industrial applications
- Automotive electronics
- Networking equipment
- Consumer electronics
- Medical devices
- Telecommunications
- Smart home technologies
- Internet of Things (IoT) devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | End Of Life |
Part Package Code | BGA | Pin Count ! | 96 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.36 | Access Mode ! | MULTI BANK PAGE BURST |
Access Time-Max | 0.225 ns | Additional Feature ! | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 800 MHz | I/O Type | COMMON |
Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B96 |
Length | 13 mm | Memory Density | 8589934592 bit |
Memory IC Type | DDR3L DRAM | Memory Width | 16 |
Number of Functions | 1 | Number of Ports ! | 1 |
Number of Terminals | 96 | Number of Words | 536870912 words |
Number of Words Code | 512000000 | Operating Mode ! | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
Organization | 512MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies ! | 1.35 V | Qualification Status ! | Not Qualified |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 4,8 |
Standby Current-Max | 0.024 A | Supply Current-Max | 0.222 mA |
Supply Voltage-Max (Vsup) | 1.45 V | Supply Voltage-Min (Vsup) | 1.283 V |
Supply Voltage-Nom (Vsup) | 1.35 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | OTHER |
Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Width | 9 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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