H5TC8G63AMR-PBA

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The H5TC8G63AMR-PBA chip is a DDR4 SDRAM module commonly used in computing devices

  • Manufacturer Part # : H5TC8G63AMR-PBA

  • Package/Case: FBGA-96

  • Brand: SKHYNIX

  • Product Categories : DRAMs

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H5TC8G63AMR-PBA DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5TC8G63AMR-PBA or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The H5TC8G63AMR-PBA is a DDR4 SDRAM module manufactured by SK Hynix. It features a capacity of 8 gigabits (Gb), organized as 1G x 8 bits, which translates to 1 gigabyte (GB) per chip. The module operates at a standard voltage of 1.2V and supports data transfer rates up to 3200 Mbps. It utilizes a FBGA (Fine-pitch Ball Grid Array) package, ensuring efficient space utilization on the circuit board. With a CAS latency of CL22, it provides decent performance for various computing tasks. The H5TC8G63AMR-PBA is commonly used in desktop computers, laptops, and other electronic devices requiring reliable and high-speed memory. Its compact form factor and low power consumption make it suitable for a wide range of applications, including gaming, multimedia editing, and enterprise computing

H5TC8G63AMR-PBA

Key Features

  • 8 Gb DDR4 SDRAM
  • High-speed data transfer rates
  • Low power consumption
  • 4.266 Gbps/pin data transfer rate
  • Operates at 1.2V power supply
  • 77-ball FBGA package

Application

  • Mobile devices
  • Computing systems
  • Industrial applications
  • Automotive electronics
  • Networking equipment
  • Consumer electronics
  • Medical devices
  • Telecommunications
  • Smart home technologies
  • Internet of Things (IoT) devices

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code End Of Life
Part Package Code BGA Pin Count ! 96
Reach Compliance Code compliant ECCN Code EAR99
HTS Code ! 8542.32.00.36 Access Mode ! MULTI BANK PAGE BURST
Access Time-Max 0.225 ns Additional Feature ! AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz I/O Type COMMON
Interleaved Burst Length 4,8 JESD-30 Code R-PBGA-B96
Length 13 mm Memory Density 8589934592 bit
Memory IC Type DDR3L DRAM Memory Width 16
Number of Functions 1 Number of Ports ! 1
Number of Terminals 96 Number of Words 536870912 words
Number of Words Code 512000000 Operating Mode ! SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 512MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Equivalence Code BGA96,9X16,32 Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies ! 1.35 V Qualification Status ! Not Qualified
Refresh Cycles 8192 Seated Height-Max 1.2 mm
Self Refresh YES Sequential Burst Length 4,8
Standby Current-Max 0.024 A Supply Current-Max 0.222 mA
Supply Voltage-Max (Vsup) 1.45 V Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V Surface Mount ! YES
Technology CMOS Temperature Grade ! OTHER
Terminal Form ! BALL Terminal Pitch ! 0.8 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 9 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H5TC8G63AMR-PBA PDF Download

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