HY5DU56822BT-D43

Effective Inventory3,317

32MX8 DDR DRAM with 0.7ns access speed

  • Manufacturer Part # : HY5DU56822BT-D43

  • Package/Case: TSOP66

  • Brand: HYNIX

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

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HY5DU56822BT-D43 DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for HY5DU56822BT-D43 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

The HY5DU56822BT-D43 is a Double Data Rate 2 (DDR2) Synchronous DRAM (SDRAM) module manufactured by Hynix Semiconductor. It has a capacity of 1GB (1 Gigabyte) and operates at a voltage of 1.8V. The module features a 240-pin Small Outline Dual Inline Memory Module (SODIMM) form factor, with a clock frequency of 400 MHz and a maximum data transfer rate of 800 MT/s (megatransfers per second). It has a CAS latency of 4 clock cycles and supports advanced memory technologies like Self Refresh and Auto Refresh.The HY5DU56822BT-D43 is designed for use in laptop and desktop computers as well as other computing devices that require high-speed memory for processing data efficiently. It is compatible with a wide range of systems and motherboards that support DDR2 memory modules.

Key Features

  • DDR2 SDRAM
  • 512Mb density per device
  • 2 Banks
  • 4 bits pre-fetch architecture
  • 400 MHz clock frequency
  • Double data rate architecture
  • 3.0 V power supply
  • RoHS compliant
  • High-speed data transfer rate

Application

  • Embedded systems
  • Consumer electronics
  • Networking equipment
  • Telecommunications
  • Automotive electronics
  • Industrial control systems
  • Medical devices
  • Military and aerospace applications
  • Security systems
  • Instrumentation

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code No Rohs Code No
Part Life Cycle Code Obsolete Part Package Code TSOP2
Pin Count ! 66 Reach Compliance Code
ECCN Code EAR99 HTS Code ! 8542.32.00.24
Access Mode ! FOUR BANK PAGE BURST Access Time-Max 0.7 ns
Additional Feature ! AUTO/SELF REFRESH Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66 Length 22.225 mm
Memory Density 268435456 bit Memory IC Type DDR1 DRAM
Memory Width 8 Number of Functions 1
Number of Ports ! 1 Number of Terminals 66
Number of Words 33554432 words Number of Words Code 32000000
Operating Mode ! SYNCHRONOUS Operating Temperature-Max 70 °C
Operating Temperature-Min Organization 32MX8
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TSOP2 Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED Power Supplies ! 2.5 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Seated Height-Max 1.194 mm Self Refresh YES
Sequential Burst Length 2,4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.29 mA Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.5 V Supply Voltage-Nom (Vsup) 2.6 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Form ! GULL WING
Terminal Pitch ! 0.65 mm Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED Width 10.16 mm

Specification Comparison

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification HY5DU56822BT-D43 PDF Download

FAQs

What is HY5DU56822BT-D43?

The HY5DU56822BT-D43 is a 512Mb DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) module designed by Hynix Semiconductor. It is suitable for various computing and electronic applications that require high-speed and high-density memory storage.

How Does HY5DU56822BT-D43 Work?

The HY5DU56822BT-D43 works as a DDR2 SDRAM module that provides fast and efficient random access memory for storing and retrieving data in electronic devices. It operates at a double data rate, allowing data to be transferred on both the rising and falling edges of the clock signal, thereby doubling the data transmission rate compared to traditional SDRAM.

How Many Pins does HY5DU56822BT-D43 have and What are the Functions of the Pinout Configuration?

The HY5DU56822BT-D43 is typically housed in a 60-ball BGA (Ball Grid Array) package. The pinout configuration includes:

  • DQ0-DQ7: Data input/output pins.
  • DQS0, DQS1: Data strobe pins for byte 0 and byte 1.
  • DM0, DM1: Data mask pins for byte 0 and byte 1.
  • CLK, /CLK: Clock input and inverted clock input pins.
  • CS: Chip select input pin.
  • WE: Write enable input pin.
  • CAS, RAS: Column address strobe and row address strobe input pins.
  • BA0-BA2: Bank address inputs.
  • CKE, ODT: Clock enable and output driver enable pins.
  • RESET, VDD, VSS: Reset, power supply, and ground pins, respectively.

What are the Pros and Cons of HY5DU56822BT-D43?

Pros:

  • High Density: Offers 512Mb of memory capacity for storage-intensive applications.
  • High Speed: Operates at a fast clock speed, facilitating rapid data access.
  • DDR2 Technology: Utilizes DDR2 SDRAM technology for improved data transfer rates.
  • BGA Package: BGA packaging provides a compact form factor and good thermal performance.
  • Reliability: Manufactured by Hynix, a reputable semiconductor company known for quality memory products.

Cons:

  • Compatibility: Requires a system that supports DDR2 SDRAM technology.
  • Complexity: Configuration and timing parameters may need to be correctly set up for proper operation.
  • Cost: DDR2 SDRAM modules may be more expensive compared to older SDRAM technologies.

Are There Any Equivalents/Alternatives to HY5DU56822BT-D43 for Recommendation?

  • Alternatives to the HY5DU56822BT-D43 include the MT47H64M16HR-25E from Micron Technology and the K4H511638J-LCCC from Samsung Electronics.
  • Equivalent parts to the HY5DU56822BT-D43 within the Hynix product line may include similar DDR2 SDRAM modules with varying capacities and speed ratings.

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