K4B1G0846G-BCH9

Name: K4B1G0846G-BCH9
Rating: 4.5 (10 reviews)

CMOS technology

3,121 Effective Inventory

K4B1G0846G-BCH9

Effective Inventory3,121

CMOS technology

Manufacturer Part # : K4B1G0846G-BCH9
Package/Case: FBGA
Brand: SAMSUNG
Product Categories : Controllers

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

K4B1G0846G-BCH9 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for K4B1G0846G-BCH9 or email to us: Email: [email protected], we will contact you in 12 hours.

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Details

1Gb G-die DDR3 SDRAM 78FBGA with Lead-Free & Halogen-Free (RoHS compliant)The 1Gb DDR3 SDRAM G-die is organized as a 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 1866Mb/sec/pin (DDR3- 1866) for general applications.The chip is designed to comply with the following key DDR3 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset .Key Features• JEDEC standard 1.5V ± 0.075V Power Supply• VDDQ = 1.5V ± 0.075V• 400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin, 667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin 900MHz fCK for 1866Mb/sec/pin• 8 Banks• Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11,13• Programmable Additive Latency: 0, CL-2 or CL-1 clock• Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6 (DDR3-1066), 7 (DDR3-1333), 8 (DDR3-1600) and 9 (DDR3-1866)• 8-bit pre-fetch• Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either On the fly using A12 or MRS]• Bi-directional Differential Data-Strobe• Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)• On Die Termination using ODT pin• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C

Key Features

JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin, 667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin 900MHz fCK for 1866Mb/sec/pin
8 Banks
Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11,13
Programmable Additive Latency: 0, CL-2 or CL-1 clock
Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6 (DDR3-1066), 7 (DDR3-1333), 8 (DDR3-1600) and 9 (DDR3-1866)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either On the fly using A12 or MRS]
Bi-directional Differential Data-Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C
Asynchronous Reset
Package : 78 balls FBGA - x4/x8
All of Lead-Free products are compliant for RoHS
All of products are Halogen-free

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code	Yes	Rohs Code	Yes
Part Life Cycle Code	Obsolete	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code !	8542.32.00.32
Access Time-Max	0.255 ns	Clock Frequency-Max (fCLK)	667 MHz
I/O Type	COMMON	Interleaved Burst Length	4,8
JESD-30 Code	R-PBGA-B78	JESD-609 Code	e1
Memory Density	1073741824 bit	Memory IC Type	DDR3 DRAM
Memory Width	8	Moisture Sensitivity Level	3
Number of Terminals	78	Number of Words	134217728 words
Number of Words Code	128000000	Organization	128MX8
Output Characteristics	3-STATE	Package Body Material	PLASTIC/EPOXY
Package Code	FBGA	Package Equivalence Code	BGA78,9X13,32
Package Shape	RECTANGULAR	Package Style	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)	260	Power Supplies !	1.5 V
Qualification Status !	Not Qualified	Refresh Cycles	8192
Sequential Burst Length	4,8	Supply Current-Max	0.13 mA
Supply Voltage-Nom (Vsup)	1.5 V	Surface Mount !	YES
Technology	CMOS	Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form !	BALL	Terminal Pitch !	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification K4B1G0846G-BCH9 PDF Download