K4B1G1646G-BCK0

Effective Inventory3,677

The K4B1G1646G-BCK0 is a dynamic random-access memory (DRAM) chip produced by Samsung

  • Manufacturer Part # : K4B1G1646G-BCK0

  • Package/Case: FBGA-96

  • Brand: SAMSUNG

  • Product Categories : Controllers

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

ship1 ship2 ship3 ship4 ship5 ship6

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

questionContent1 questionContent2 questionContent3 questionContent4 ctc pelican express chunghwa post

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

wire

WireTransfer

questionContent7

Paypal

cc

CreditCard

western

WesternUnion

mg

MoneyGram

Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

pg

Example

Tape and Reel

Tape and Reel

Cut Tape

Cut Tape

Tube or Tray

Tube or Tray

K4B1G1646G-BCK0 DataSheet

no-price

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for K4B1G1646G-BCK0 or email to us: Email: [email protected], we will contact you in 12 hours.

Details

K4B1G1646G-BCK0 is a specific model of DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) manufactured by Samsung. It features a capacity of 8 gigabits (Gb), which translates to 1 gigabyte (GB) per chip. With a configuration of 16 chips, it achieves a total capacity of 2 GB. The "BCK0" part of the model number signifies the speed grade, indicating its maximum data transfer rate of 2133 megatransfers per second (MT/s). This memory module operates at a low voltage of 1.2 volts, enhancing energy efficiency. Designed for compatibility with various computing devices, it adheres to JEDEC standards for DDR4 memory. Its compact form factor and efficient performance make it suitable for a wide range of applications, from personal computers to servers and networking devices. Additionally, its reliability and high-speed capabilities contribute to improved system performance and responsiveness

Key Features

  • 1Gb DDR3 SDRAM
  • Memory organization: 128Mx8
  • Data rate: 1333Mbps
  • Operating voltage: 1.5V
  • JEDEC standard specification compliant
  • High-speed data transfer
  • Low power consumption
  • RoHS compliant
  • Lead-free technology
  • Available in BGA packaging

Application

  • Computer memory
  • Smartphones
  • Tablets
  • Network switches
  • Industrial applications
  • Automotive electronics
  • Virtual reality devices
  • Medical devices
  • Digital cameras
  • Solid-state drives (SSDs)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code Yes Rohs Code Yes
Part Life Cycle Code Obsolete Reach Compliance Code compliant
ECCN Code EAR99 HTS Code ! 8542.32.00.32
Access Time-Max 0.225 ns Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96 JESD-609 Code e3
Memory Density 1073741824 bit Memory IC Type DDR3 DRAM
Memory Width 16 Moisture Sensitivity Level 1
Number of Terminals 96 Number of Words 67108864 words
Number of Words Code 64000000 Organization 64MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code FBGA Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 Power Supplies ! 1.5 V
Qualification Status ! Not Qualified Refresh Cycles 8192
Sequential Burst Length 4,8 Standby Current-Max 0.01 A
Supply Current-Max 0.195 mA Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount ! YES Technology CMOS
Terminal Finish MATTE TIN Terminal Form ! BALL
Terminal Pitch ! 0.8 mm Terminal Position BOTTOM

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification K4B1G1646G-BCK0 PDF Download

Recommend Parts

  • K4T1G164QQ-HCE6

    Ultra-fast data transmission for seamless device operation

    Brand: SAMSUNG Package/Case: FBGA-84

    3,956 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4H561638H-UCB3

    16MX16 DDR DRAM 0.7ns CMOS PDSO66

    Brand: Samsung Package/Case: TSSOP66

    7,629 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S281632K-UC75

    Plastic TSOP Memory Module, 8M x 16 Configuration, 54 Pin SDRAM

    Brand: Samsung Semiconductor Package/Case: TSSOP-54

    3,967 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S561632J-UC75

    Compact 54-pin Thin Small Outline Package (TSOP-II) design, suitable for use in a variety of electronic devices

    Brand: Samsung Electro-Mechanics Package/Case: TSOP-II

    3,251 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S641632H-TC60

    4M x 16 SDRAM in TSOP plastic packaging

    Brand: Samsung Semiconductor Package/Case: TSSOP54

    4,793 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4B4G1646D-BCMA

    High-performance computing relies on this modul

    Brand: Samsung Electro-Mechanics Package/Case: FBGA

    3,892 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4B4G1646D-BCK0

    DRAM Chip DDR3 SDRAM 4Gbit

    Brand: Samsung Electronics Package/Case: FBGA

    6,207 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S641632H-TC75

    SDRAM, 4M x 16, 54 Pin, Plastic, TSOP

    Brand: Samsung Semiconductor Package/Case: TSOP-54

    6,058 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4H510838F-LCCC

    High-speed CMOS technology

    Brand: SAMSUNG Package/Case: TSOP-66

    3,054 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S641632K-UC75

    PDSO54 Synchronous DRAM chip offering 4MX16 storage and operating at 5.4ns speed in CMOS technology

    Brand: SAMSUNG Package/Case: TSOP-54

    5,452 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4S561632H-UC75

    256Mbit DRAM chip designed for Synchronous Dynamic Random Access Memory

    Brand: SAMSUNG Package/Case: TSOP-54

    5,085 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4H561638N-LCCC

    The K4H561638N-LCCC is a dynamic random-access memory (DRAM) chip commonly used in electronic devices for data storage and retrieval

    Brand: SAMSUNG Package/Case: TSOP66

    3,297 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4B2G1646C-HCH9

    The K4B2G1646C-HCH9 chip is a DDR4 SDRAM produced by Samsung

    Brand: SAMSUNG Package/Case: FBGA-96

    7,460 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4B2G0846B-HCF8

    K4B2G0846B-HCF8 is a NAND flash memory chip manufactured by Samsung

    Brand: SAMSUNG Package/Case: FBGA-78

    6,703 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4E8E324EB-EGCF $8.958

    K4E8E324EB-EGCF SAMSUNG

    Brand: SAMSUNG Package/Case: BGA

    5,938 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1

  • K4H511638D-UCB3

    K4H511638D-UCB3 offers efficient memory processing capabilities

    Brand: Samsung Semiconductor Package/Case: TSOP-66

    3,153 In Stock

    Cargo cycle: 3~7 Days

    The minimum order is 1