K4B2G0846C-HCH9
K4B2G0846C-HCH9 is a high-performance 2Gb DDR3 SDRAM chip designed for optimal efficiency.K4B2G0846C-HCH9
K4B2G0846C-HCH9 is a high-performance 2Gb DDR3 SDRAM chip designed for optimal efficiency.
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
K4B2G0846C-HCH9 DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4B2G0846C-HCH9 is a 2Gb DDR3 SDRAM memory chip developed by Samsung. It features a voltage range of 1.425V to 1.575V and operates at a clock frequency of 1866 MHz. The chip has a burst length of 8 and a CAS latency of 13, providing reliable and efficient performance for a variety of computing applications.The memory chip is organized as 8 banks with a total of 16,382 refresh cycles every 64ms. It also includes an auto refresh and self refresh mode for power efficiency. The K4B2G0846C-HCH9 supports temperature sensor readout and on-die termination (ODT) for improved signal integrity and stability.In terms of physical specifications, the memory chip comes in a 78-ball FBGA package with a ball pitch of 0.67mm. It operates within a temperature range of -40°C to 95°C, making it suitable for a wide range of operating environments.
Key Features
- 4Gb DDR3 SDRAM
- High-speed CMOS Synchronous DRAM
- Single 1.35V power supply
- JEDEC standard
- Programmable read or write burst lengths
- Auto and self-refresh modes
- Available in 96-ball FBGA package
Application
- Smartphones
- Tablets
- Laptops
- Digital cameras
- MP3 players
- Portable gaming devices
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code ! | 8542.32.00.36 | Clock Frequency-Max (fCLK) | 667 MHz |
I/O Type | COMMON | Interleaved Burst Length | 8 |
JESD-30 Code | R-PBGA-B78 | JESD-609 Code | e1 |
Memory Density | 2147483648 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 8 | Number of Terminals | 78 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
Organization | 256MX8 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | FBGA |
Package Equivalence Code | BGA78,9X13,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, FINE PITCH | Power Supplies ! | 1.5 V |
Qualification Status ! | Not Qualified | Refresh Cycles | 8192 |
Sequential Burst Length | 8 | Standby Current-Max | 0.012 A |
Supply Current-Max | 0.21 mA | Supply Voltage-Nom (Vsup) | 1.5 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | OTHER | Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form ! | BALL | Terminal Pitch ! | 0.8 mm |
Terminal Position | BOTTOM |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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