K4H561638N-LCB3
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66K4H561638N-LCB3
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
![ship1](/img/ship1.png)
![ship2](/img/ship2.png)
![ship3](/img/ship3.png)
![ship4](/img/ship4.png)
![ship5](/img/ship5.png)
![ship6](/img/ship6.png)
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
![questionContent1](/img/questionContent1.png)
![questionContent2](/img/questionContent2.png)
![questionContent3](/img/questionContent3.png)
![questionContent4](/img/questionContent4.png)
![ctc](/img//questionContentctc.png)
![pelican](/img//questionContentpelican.png)
![express](/img//questionContentexpress.png)
![chunghwa post](/img//questionContentchunghwapost.png)
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
![wire](/img/wire.png)
WireTransfer
![questionContent7](/img/questionContent7.png)
Paypal
![cc](/img/cc.png)
CreditCard
![western](/img/western.png)
WesternUnion
![mg](/img/mg.png)
MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
![pg](/img/pg.png)
Example
![Tape and Reel](/img/Tape and Reel.png)
Tape and Reel
![Cut Tape](/img/Cut Tape.png)
Cut Tape
![Tube or Tray](/img/Tube or Tray.png)
Tube or Tray
K4H561638N-LCB3 DataSheet
![no-price](/img/no-price.jpg)
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
The K4H560438N / K4H560838N / K4H561638N is 268,435,456 bits of double data rate synchronous DRAM organized as 4x 16,777,216 / 4x 8,388,608 / 4x 4,194,304 words by 4/8/16bits, fabricated with SAMSUNG′s high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 400Mb/s per pin. I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications. Features• VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V• Double-data-rate architecture; two data transfers per clock cycle• Bidirectional data strobe [DQS] (x4,x8) & [L(U)DQS] (x16)• Four banks operation• Differential clock inputs(CK and CK)• DLL aligns DQ and DQS transition with CK transition• MRS cycle with address key programs -. Read latency : DDR266(2, 2.5 Clock), DDR333(2.5 Clock), DDR400(3 Clock) -. Burst length (2, 4, 8) -. Burst type (sequential & interleave)• All inputs except data & DM are sampled at the positive going edge of the system clock(CK)• Data I/O transactions on both edges of data strobe• Edge aligned data output, center aligned data input• LDM,UDM for write masking only (x16)• DM for write masking only (x4, x8)• Auto & Self refresh• 7.8us refresh interval(8K/64ms refresh)• Maximum burst refresh cycle : 8• 66pin TSOP II Lead-Free & Halogen-Free package• RoHS compliant
Key Features
- VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V Double-data-rate architecture; two data transfers per clock cycle Bidirectional data strobe [DQS] (x4,x8) & [L(U)DQS] (x16) Four banks operation Differential clock inputs(CK and CK) DLL aligns DQ and DQS transition with CK transition MRS cycle with address key programs -. Read latency : DDR266(2, 2.5 Clock), DDR333(2.5 Clock), DDR400(3 Clock) -. Burst length (2, 4, 8) -. Burst type (sequential & interleave) All inputs except data & DM are sampled at the positive going edge of the system clock(CK) Data I/O transactions on both edges of data strobe Edge aligned data output, center aligned data input LDM,UDM for write masking only (x16) DM for write masking only (x4, x8) Auto & Self refresh 7.8us refresh interval(8K/64ms refresh) Maximum burst refresh cycle : 8 66pin TSOP II Lead-Free & Halogen-Free package RoHS compliant
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.24 |
Access Time-Max | 0.7 ns | Clock Frequency-Max (fCLK) | 166 MHz |
I/O Type | COMMON | Interleaved Burst Length | 2,4,8 |
JESD-30 Code | R-PDSO-G66 | JESD-609 Code | e3 |
Memory Density | 268435456 bit | Memory IC Type | DDR1 DRAM |
Memory Width | 16 | Moisture Sensitivity Level | 3 |
Number of Terminals | 66 | Number of Words | 16777216 words |
Number of Words Code | 16000000 | Operating Temperature-Max | 70 °C |
Operating Temperature-Min | Organization | 16MX16 | |
Output Characteristics | 3-STATE | Package Body Material | PLASTIC/EPOXY |
Package Code | TSSOP | Package Equivalence Code | TSSOP66,.46 |
Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Cel) | 260 | Power Supplies ! | 2.5 V |
Qualification Status ! | Not Qualified | Refresh Cycles | 8192 |
Sequential Burst Length | 2,4,8 | Standby Current-Max | 0.003 A |
Supply Current-Max | 0.12 mA | Supply Voltage-Nom (Vsup) | 2.5 V |
Surface Mount ! | YES | Technology | CMOS |
Temperature Grade ! | COMMERCIAL | Terminal Finish | MATTE TIN |
Terminal Form ! | GULL WING | Terminal Pitch ! | 0.635 mm |
Terminal Position | DUAL | Time@Peak Reflow Temperature-Max (s) | 30 |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
Recommend Parts
-
Ultra-fast data transmission for seamless device operation
Brand: SAMSUNG Package/Case: FBGA-84
3,956 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
7,629 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
Plastic TSOP Memory Module, 8M x 16 Configuration, 54 Pin SDRAM
Brand: Samsung Semiconductor Package/Case: TSSOP-54
3,967 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
Compact 54-pin Thin Small Outline Package (TSOP-II) design, suitable for use in a variety of electronic devices
Brand: Samsung Electro-Mechanics Package/Case: TSOP-II
3,251 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
4M x 16 SDRAM in TSOP plastic packaging
Brand: Samsung Semiconductor Package/Case: TSSOP54
4,793 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
High-performance computing relies on this modul
Brand: Samsung Electro-Mechanics Package/Case: FBGA
3,892 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
6,207 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
SDRAM, 4M x 16, 54 Pin, Plastic, TSOP
Brand: Samsung Semiconductor Package/Case: TSOP-54
6,058 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
3,054 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
PDSO54 Synchronous DRAM chip offering 4MX16 storage and operating at 5.4ns speed in CMOS technology
Brand: SAMSUNG Package/Case: TSOP-54
5,452 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
256Mbit DRAM chip designed for Synchronous Dynamic Random Access Memory
Brand: SAMSUNG Package/Case: TSOP-54
5,085 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
The K4H561638N-LCCC is a dynamic random-access memory (DRAM) chip commonly used in electronic devices for data storage and retrieval
Brand: SAMSUNG Package/Case: TSOP66
3,297 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
The K4B2G1646C-HCH9 chip is a DDR4 SDRAM produced by Samsung
Brand: SAMSUNG Package/Case: FBGA-96
7,460 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
K4B2G0846B-HCF8 is a NAND flash memory chip manufactured by Samsung
Brand: SAMSUNG Package/Case: FBGA-78
6,703 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
5,938 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1
-
K4H511638D-UCB3 offers efficient memory processing capabilities
Brand: Samsung Semiconductor Package/Case: TSOP-66
3,153 In Stock
Cargo cycle: 3~7 Days
The minimum order is 1