MT29F8G08ABABAWP
IC FLASH 8GBIT PARALLEL 48TSOP IMT29F8G08ABABAWP
IC FLASH 8GBIT PARALLEL 48TSOP I
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
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Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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MT29F8G08ABABAWP DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
General DescriptionMicron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (I/Ox) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection and monitor device status (R/B#).This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densi ties with no board redesign.A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). There is at least one NAND Flash die per chip enable signal. For further details, see Device and Array Organization.This device has an internal 4-bit ECC that can be enabled using the GET/SET features.See Internal ECC and Spare Area Mapping for ECC for more information.Features• Open NAND Flash Interface (ONFI) 1.0-compliant1• Single-level cell (SLC) technology• Organization – Page size x8: 2112 bytes (2048 + 64 bytes) – Page size x16: 1056 words (1024 + 32 words) – Block size: 64 pages (128K + 4K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks 16Gb: 16,384 blocks• Asynchronous I/O performance – tRC/tWC: 20ns (3.3V), 25ns (1.8V)• Array performance – Read page: 25µs 3 – Program page: 200µs (TYP: 1.8V, 3.3V)3 – Erase block: 700µs (TYP)• Command set: ONFI NAND Flash Protocol• Advanced command set – Program page cache mode4 – Read page cache mode 4 – One-time programmable (OTP) mode – Two-plane commands 4 – Interleaved die (LUN) operations – Read unique ID – Block lock (1.8V only) – Internal data move• Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status• Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion• WP# signal: Write protect entire device• First block (block address 00h) is valid when ship ped from factory with ECC. For minimum required ECC, see Error Management.• Block 0 requires 1-bit ECC if PROGRAM/ERASE cycles are less than 1000• RESET (FFh) required as first command after power-on• Alternate method of device initialization (Nand_In it) after power up (contact factory)• Internal data move operations supported within the plane from which data is read• Quality and reliability – Data retention: 10 years – Endurance: 100,000 PROGRAM/ERASE cycles• Operating voltage range – VCC: 2.7–3.6V – VCC: 1.7–1.95V• Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC• Package – 48-pin TSOP type 1, CPL2 – 63-ball VFBGA
Key Features
- Open NAND Flash Interface (ONFI) 1.0-compliant1
- Single-level cell (SLC) technology
- Organization
- – Page size x8: 2112 bytes (2048 + 64 bytes)
- – Page size x16: 1056 words (1024 + 32 words)
- – Block size: 64 pages (128K + 4K bytes)
- – Plane size: 2 planes x 2048 blocks per plane
- – Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks 16Gb: 16,384 blocks
- Asynchronous I/O performance
- – tRC/tWC: 20ns (3.3V), 25ns (1.8V)
- Array performance
- – Read page: 25µs 3
- – Program page: 200µs (TYP: 1.8V, 3.3V)3
- – Erase block: 700µs (TYP)
- Command set: ONFI NAND Flash Protocol
- Advanced command set
- – Program page cache mode4
- – Read page cache mode 4
- – One-time programmable (OTP) mode
- – Two-plane commands 4
- – Interleaved die (LUN) operations
- – Read unique ID
- – Block lock (1.8V only)
- – Internal data move
- Operation status byte provides software method for detecting
- – Operation completion
- – Pass/fail condition
- – Write-protect status
- Ready/Busy# (R/B#) signal provides a hardware method of detecting operation completion
- WP# signal: Write protect entire device
- First block (block address 00h) is valid when ship ped from factory with ECC. For minimum required ECC, see Error Management.
- Block 0 requires 1-bit ECC if PROGRAM/ERASE cycles are less than 1000
- RESET (FFh) required as first command after power-on
- Alternate method of device initialization (Nand_In it) after power up (contact factory)
- Internal data move operations supported within the plane from which data is read
- Quality and reliability
- – Data retention: 10 years
- – Endurance: 100,000 PROGRAM/ERASE cycles
- Operating voltage range
- – VCC: 2.7–3.6V
- – VCC: 1.7–1.95V
- Operating temperature:
- – Commercial: 0°C to +70°C
- – Industrial (IT): –40ºC to +85ºC
- Package
- – 48-pin TSOP type 1, CPL2
- – 63-ball VFBGA
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Category | Integrated Circuits (ICs)MemoryMemory | Mfr | Micron Technology Inc. |
Series | - | Package | Tray |
Product Status | Obsolete | Programmable | Verified |
Memory Type ! | Non-Volatile | Memory Format | FLASH |
Technology | FLASH - NAND | Memory Size ! | 8Gbit |
Memory Organization | 1G x 8 | Memory Interface ! | Parallel |
Write Cycle Time - Word, Page | - | Voltage - Supply | 2.7V ~ 3.6V |
Operating Temperature ! | 0°C ~ 70°C (TA) | Mounting Type | Surface Mount |
Package / Case | 48-TFSOP (0.724", 18.40mm Width) | Supplier Device Package | 48-TSOP I |
Base Product Number | MT29F8G08 |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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