THGBMHG8C4LBAAR
Pre-Ordered THGBMHG8C4LBAAR Product: ROHS Certification IncludedTHGBMHG8C4LBAAR
Pre-Ordered THGBMHG8C4LBAAR Product: ROHS Certification Included
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Manufacturer Part # : THGBMHG8C4LBAAR
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Package/Case: BGA
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Brand: Kioxia
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Product Categories : Memory
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
WireTransfer
Paypal
CreditCard
WesternUnion
MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
THGBMHG8C4LBAAR DataSheet
Pricing (USD)
Quantity | Unit Price | Ext. Price |
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1 | $8.835 | $8.84 |
These prices are subject to market fluctuations, and a quote submission is required to obtain the latest prices.
Details
The THGBMHG8C4LBAAR 64-layer 3D NAND flash memory chip, manufactured by Toshiba Memory Corporation, is a state-of-the-art storage solution with a capacity of 256 gigabits (32 gigabytes). Utilizing BiCS (Bit Cost Scalable) architecture, it delivers increased data density and enhanced performance for a wide range of applications. Equipped with a Toggle DDR interface and a data transfer rate of up to 533 megatransfers per second, this chip ensures rapid and efficient data processing. Additionally, it includes advanced error correction, wear leveling, and bad block management features to uphold data integrity and longevity. With read speeds of up to 525 megabytes per second and write speeds of up to 515 megabytes per second, the THGBMHG8C4LBAAR chip is ideal for solid-state drives (SSDs), smartphones, tablets, and other high-speed storage devices
Key Features
- Fast read and write speeds
- Enhanced power management
- Advanced memory technology
- Simplified integration process
Application
- Smart gadgets
- Advanced tech
- Innovative devices
- High-tech solutions
- Modern appliances
- Tech-savvy products
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Part Life Cycle Code | Obsolete | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.71 |
Date Of Intro | 2017-06-23 | JESD-30 Code | R-PBGA-B |
Memory Density | 274877906944 bit | Memory IC Type | MEMORY CIRCUIT |
Memory Width | 8 | Number of Functions | 1 |
Number of Words | 34359738368 words | Number of Words Code | 32000000000 |
Operating Mode ! | ASYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 32GX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Shape | RECTANGULAR | Package Style | GRID ARRAY |
Screening Level | AEC-Q100 | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
Terminal Form ! | BALL | Terminal Position | BOTTOM |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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