THGBMJG8C2LBAIL
THGBMJG8C2LBAIL ROHS eMMC FBGA-153THGBMJG8C2LBAIL
THGBMJG8C2LBAIL ROHS eMMC FBGA-153
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
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Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
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About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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WireTransfer
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Paypal
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CreditCard
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WesternUnion
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MoneyGram
Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
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Example
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Tape and Reel
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Cut Tape
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Tube or Tray
THGBMJG8C2LBAIL DataSheet
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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
THGBMJG8C2LBAIL is a NAND flash memory module designed by Toshiba. It falls under the category of IC Flash 256Gbit EMMC 153FBGA, indicating that it has a storage capacity of 256 gigabits, or 32 gigabytes. The EMMC designation stands for Embedded MultiMediaCard, which means that this flash memory module is commonly found in embedded systems such as smartphones, tablets, and other portable devices. The 153FBGA refers to the package type of the component, which is a fine-pitch ball grid array with 153 balls. This type of package allows for easy installation on a circuit board while maximizing space efficiency. THGBMJG8C2LBAIL features high-speed data transfer capabilities, low power consumption, and reliable storage performance. It is commonly used in applications that require high-density data storage, such as mobile devices, automotive infotainment systems, and industrial equipment.
Key Features
- 64GB capacity
- 3D NAND flash technology
- SATA 6.0Gb/s interface
- Up to 560MB/s read speed
- Up to 530MB/s write speed
- Low power consumption
- Compact and lightweight design
- Shock and vibration resistant
- TRIM support
Application
- Smartphones
- Tablets
- Laptops
- Digital cameras
- Portable gaming devices
- Automotive infotainment systems
- Smart home devices
- Industrial equipment
- Medical devices
- Wearables
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Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Part Life Cycle Code | Obsolete | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.51 |
JESD-30 Code | R-PBGA-B153 | Length | 13 mm |
Memory Density | 274877906944 bit | Memory IC Type | FLASH CARD |
Memory Width | 8 | Number of Functions | 1 |
Number of Terminals | 153 | Number of Words | 34359738368 words |
Number of Words Code | 32000000000 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -25 °C | Organization | 32GX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA153,14X14,20 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | OTHER |
Terminal Form ! | BALL | Terminal Pitch ! | 0.5 mm |
Terminal Position | BOTTOM | Width | 11 mm |
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
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