THGBMJG9C8LBAU8

Name: THGBMJG9C8LBAU8
Rating: 4.5 (10 reviews)

e-MMC TLC NAND Flash Serial 3.3V 512G-bit 153-Pin FBGA

6,430 Effective Inventory

THGBMJG9C8LBAU8

Effective Inventory6,430

e-MMC TLC NAND Flash Serial 3.3V 512G-bit 153-Pin FBGA

Manufacturer Part # : THGBMJG9C8LBAU8
Package/Case: 153-WFBGA
Brand: TOSHIBA
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

THGBMJG9C8LBAU8 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for THGBMJG9C8LBAU8 or email to us: Email: [email protected], we will contact you in 12 hours.

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Details

The THGBMJG9C8LBAU8 is a high-quality electronic component classified as an IC Flash 512Gbit eMMC in a 153-ball fine pitch BGA package. This component is commonly used in various electronic devices such as smartphones, tablets, laptops, and other portable consumer electronics. The THGBMJG9C8LBAU8 offers a massive storage capacity of 512 gigabits, allowing for ample space to store data, multimedia files, and applications. The eMMC interface of this component enables seamless data transfer and read/write operations, making it ideal for high-performance devices that require fast access to data. With its small 153-ball fine pitch BGA package, the THGBMJG9C8LBAU8 is compact and space-saving, making it suitable for use in compact and lightweight electronic devices. The component is also designed to operate efficiently and reliably, ensuring stable performance even in demanding applications.

Key Features

64GB capacity
Low-power DDR4 SDRAM technology
Supports LPDDR4X interface
1.8V power supply
Available in 14x18mm package size
Operational temperature range of -25°C to 85°C
Compatible with various applications like smartphones, tablets, and automotive systems

Application

Smartphones
Tablets
Ultrabooks
Internet of Things (IoT) devices
Automotive applications
Medical devices
Industrial equipment
Networking equipment
Gaming devices
Wearable technology

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Part Life Cycle Code	Active	Reach Compliance Code
ECCN Code	EAR99	HTS Code !	8542.32.00.51
Date Of Intro	2019-10-02	Clock Frequency-Max (fCLK)	52 MHz
JESD-30 Code	R-PBGA-B153	Length	13 mm
Memory Density	549755813888 bit	Memory IC Type	FLASH CARD
Memory Width	8	Number of Functions	1
Number of Terminals	153	Number of Words	68719476736 words
Number of Words Code	64000000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	105 °C	Operating Temperature-Min	-40 °C
Organization	64GX8	Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH	Parallel/Serial	PARALLEL
Programming Voltage !	2.7 V	Seated Height-Max	1.2 mm
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3.3 V	Surface Mount !	YES
Technology	CMOS	Temperature Grade !	INDUSTRIAL
Terminal Form !	BALL	Terminal Pitch !	0.5 mm
Terminal Position	BOTTOM	Width	11.5 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification THGBMJG9C8LBAU8 PDF Download

FAQs

What is THGBMJG9C8LBAU8?

The THGBMJG9C8LBAU8 is a NAND flash memory module manufactured by Toshiba. It is commonly used in a variety of electronic devices such as smartphones, tablets, and digital cameras for storing data and programs.

How Does THGBMJG9C8LBAU8 Work?

The THGBMJG9C8LBAU8 works by storing data in a non-volatile memory array composed of multiple NAND flash memory cells. It utilizes a controller to manage data read and write operations, wear leveling, error correction, and bad block management. The NAND flash memory allows for high-speed data access and reliable storage of information.

How Many Pins does THGBMJG9C8LBAU8 have and What are the Functions of the Pinout Configuration?

The THGBMJG9C8LBAU8 typically comes in a BGA (Ball Grid Array) package with multiple pins for various functions. The pinout configuration includes power supply pins, data input/output pins, control pins for communication with the host device, and other pins for internal memory management operations.

What are the Pros and Cons of THGBMJG9C8LBAU8?

Pros:

High Storage Capacity: Offers a large storage capacity for data-intensive applications.
Fast Data Access: Provides high-speed read and write operations for efficient data transfer.
Reliability: Features built-in error correction and wear leveling algorithms for data integrity.
Compact Form Factor: BGA packaging allows for a small footprint, ideal for space-constrained designs.

Cons:

Endurance Limit: NAND flash memory has a limited number of program/erase cycles, affecting longevity in heavy usage scenarios.
Complexity: Requires a controller to manage memory operations, adding complexity to the system design.

Are There Any Equivalents/Alternatives to THGBMJG9C8LBAU8 for Recommendation?

Alternatives to the THGBMJG9C8LBAU8 include similar NAND flash memory modules from manufacturers like Samsung, Micron, and SK Hynix. Some equivalents may offer different features or specifications based on the application requirements.

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