MT46V32M16BN-6

Name: MT46V32M16BN-6
Rating: 4.5 (10 reviews)

DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60

7,140 Effective Inventory

MT46V32M16BN-6

Effective Inventory7,140

DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60

Manufacturer Part # : MT46V32M16BN-6
Package/Case: FBGA
Brand: MICRON
Product Categories : Memory

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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MT46V32M16BN-6 DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

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Please submit RFQ for MT46V32M16BN-6 or email to us: Email: [email protected], we will contact you in 12 hours.

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Details

Functional DescriptionThe DDR SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 2n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the DDR SDRAM effectively consists of a single 2n-bit-wide, one-clockcycle data transfer at the internal DRAM core and two corresponding n-bit-wide, onehalf-clock-cycle data transfers at the I/O pins.Features• VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V• VDD = +2.6V ±0.1V, VDDQ = +2.6V ±0.1V (DDR400)• Bidirectional data strobe (DQS) transmitted/ received with data, i.e., source-synchronous data capture (x16 has two – one per byte)• Internal, pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle• Differential clock inputs (CK and CK#)• Commands entered on each positive CK edge• DQS edge-aligned with data for READs; centeraligned with data for WRITEs• DLL to align DQ and DQS transitions with CK• Four internal banks for concurrent operation• Data mask (DM) for masking write data (x16 has two – one per byte)• Programmable burst lengths: 2, 4, or 8• Auto refresh – 64ms, 8192-cycle(Commercial and industrial) – 16ms, 8192-cycle (Automotive)• Self refresh (not available on AT devices)• Longer-lead TSOP for improved reliability (OCPL)• 2.5V I/O (SSTL_2 compatible)• Concurrent auto precharge option is supported• tRAS lockout supported (tRAP = tRCD)

Key Features

VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V
VDD = +2.6V ±0.1V, VDDQ = +2.6V ±0.1V (DDR400)
Bidirectional data strobe (DQS) transmitted/
received with data, i.e., source-synchronous data
capture (x16 has two – one per byte)
Internal, pipelined double-data-rate (DDR)
architecture; two data accesses per clock cycle
Differential clock inputs (CK and CK#)
Commands entered on each positive CK edge
DQS edge-aligned with data for READs; centeraligned with data for WRITEs
DLL to align DQ and DQS transitions with CK
Four internal banks for concurrent operation
Data mask (DM) for masking write data
(x16 has two – one per byte)
Programmable burst lengths: 2, 4, or 8
Auto refresh
– 64ms, 8192-cycle(Commercial and industrial)
– 16ms, 8192-cycle (Automotive)
Self refresh (not available on AT devices)
Longer-lead TSOP for improved reliability (OCPL)
2.5V I/O (SSTL_2 compatible)
Concurrent auto precharge option is supported
tRAS lockout supported (tRAP = tRCD)

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Pbfree Code	Yes	Rohs Code	Yes
Part Life Cycle Code	Obsolete	Part Package Code	BGA
Pin Count !	60	Reach Compliance Code	compliant
ECCN Code	EAR99	HTS Code !	8542.32.00.28
Access Mode !	FOUR BANK PAGE BURST	Access Time-Max	0.7 ns
Additional Feature !	AUTO/SELF REFRESH	Clock Frequency-Max (fCLK)	167 MHz
I/O Type	COMMON	Interleaved Burst Length	2,4,8
JESD-30 Code	R-PBGA-B60	JESD-609 Code	e1
Length	12.5 mm	Memory Density	536870912 bit
Memory IC Type	DDR1 DRAM	Memory Width	16
Number of Functions	1	Number of Ports !	1
Number of Terminals	60	Number of Words	33554432 words
Number of Words Code	32000000	Operating Mode !	SYNCHRONOUS
Operating Temperature-Max	70 °C	Operating Temperature-Min
Organization	32MX16	Output Characteristics	3-STATE
Package Body Material	PLASTIC/EPOXY	Package Code	TBGA
Package Equivalence Code	BGA60,9X12,40/32	Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE	Peak Reflow Temperature (Cel)	260
Power Supplies !	2.5 V	Qualification Status !	Not Qualified
Refresh Cycles	8192	Seated Height-Max	1.2 mm
Self Refresh	YES	Sequential Burst Length	2,4,8
Standby Current-Max	0.005 A	Supply Voltage-Max (Vsup)	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	Supply Voltage-Nom (Vsup)	2.5 V
Surface Mount !	YES	Technology	CMOS
Temperature Grade !	COMMERCIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form !	BALL	Terminal Pitch !	1 mm
Terminal Position	BOTTOM	Width	10 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification MT46V32M16BN-6 PDF Download