MT47H32M16HW-25EIT:G
Low voltage 1.8V operationMT47H32M16HW-25EIT:G
Low voltage 1.8V operation
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Manufacturer Part # : MT47H32M16HW-25EIT:G
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Package/Case: BGA
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Brand: Micron Technology
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Product Categories : Controllers
Quality Assurance
Quality Assurance
All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.
Certification
We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.
Shipping & Payment
Shipping & Payment
About Shipping
We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.
About Payment
We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.
If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.
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Service & Packaging
Service & Packaging
About After Sales Service
All Parts Extended Quality Guarantee
Initiate the application within 90 days from the shipment date.
Confirm the return or exchange with our staff.
Maintain the goods in their original condition as received.
Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]
About packaging
Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.
Example
Tape and Reel
Cut Tape
Tube or Tray
MT47H32M16HW-25EIT:G DataSheet
Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!
Details
DDR2 SDRAMMT47H256M4 – 32 Meg x 4 x 8 banksMT47H128M8 – 16 Meg x 8 x 8 banksMT47H64M16 – 8 Meg x 16 x 8 banksFeatures• VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V• JEDEC-standard 1.8V I/O (SSTL_18-compatible)• Differential data strobe (DQS, DQS#) option• 4n-bit prefetch architecture• Duplicate output strobe (RDQS) option for x8• DLL to align DQ and DQS transitions with CK• 8 internal banks for concurrent operation• Programmable CAS latency (CL)• Posted CAS additive latency (AL)• WRITE latency = READ latency - 1 tCK• Selectable burst lengths (BL): 4 or 8• Adjustable data-output drive strength• 64ms, 8192-cycle refresh• On-die termination (ODT)• Industrial temperature (IT) option• Automotive temperature (AT) option• RoHS-compliant• Supports JEDEC clock jitter specification
Key Features
- VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
- JEDEC-standard 1.8V I/O (SSTL_18-compatible)
- Differential data strobe (DQS, DQS#) option
- 4n-bit prefetch architecture
- Duplicate output strobe (RDQS) option for x8
- DLL to align DQ and DQS transitions with CK
- 8 internal banks for concurrent operation
- Programmable CAS latency (CL)
- Posted CAS additive latency (AL)
- WRITE latency = READ latency - 1 tCK
- Selectable burst lengths (BL): 4 or 8
- Adjustable data-output drive strength
- 64ms, 8192-cycle refresh
- On-die termination (ODT)
- Industrial temperature (IT) option
- Automotive temperature (AT) option
- RoHS-compliant
- Supports JEDEC clock jitter specification
Specifications
The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.
Pbfree Code | No | Rohs Code | No |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
Part Package Code | BGA | Package Description | 8 X 12.50 MM, FBGA-84 |
Pin Count ! | 84 | Reach Compliance Code | not_compliant |
ECCN Code | EAR99 | HTS Code ! | 8542.32.00.28 |
Access Mode ! | FOUR BANK PAGE BURST | Access Time-Max | 0.4 ns |
Additional Feature ! | AUTO/SELF REFRESH | Clock Frequency-Max (fCLK) | 400 MHz |
I/O Type | COMMON | Interleaved Burst Length | 4,8 |
JESD-30 Code | R-PBGA-B84 | JESD-609 Code | e0 |
Length | 12.5 mm | Memory Density | 536870912 bit |
Memory IC Type | DDR2 DRAM | Memory Width | 16 |
Number of Functions | 1 | Number of Ports ! | 1 |
Number of Terminals | 84 | Number of Words | 33554432 words |
Number of Words Code | 32000000 | Operating Mode ! | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 32MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA84,9X15,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 235 |
Power Supplies ! | 1.8 V | Qualification Status ! | Not Qualified |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 4,8 |
Standby Current-Max | 0.007 A | Supply Current-Max | 0.215 mA |
Supply Voltage-Max (Vsup) | 1.9 V | Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V | Surface Mount ! | YES |
Technology | CMOS | Temperature Grade ! | INDUSTRIAL |
Terminal Finish | Tin/Lead/Silver (Sn/Pb/Ag) | Terminal Form ! | BALL |
Terminal Pitch ! | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 8 mm |
Specification Comparison
Datasheet PDF
Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.
FAQs
What is MT47H32M16HW-25EIT:G?
The MT47H32M16HW-25EIT:G is a 512Mb DDR2 SDRAM (Synchronous Dynamic Random Access Memory) module designed by Micron Technology. It is used in various computing and embedded systems for high-speed data storage and retrieval.
How Does MT47H32M16HW-25EIT:G Work?
The MT47H32M16HW-25EIT:G operates by storing digital data in a volatile memory array. It utilizes a synchronous interface to align data input and output with an external clock signal, enabling high-speed data transfer between the memory and the system controller. The module is organized as 32M x 16 bits and supports double data rate (DDR) operation.
How Many Pins does MT47H32M16HW-25EIT:G have and What are the Functions of the Pinout Configuration?
The MT47H32M16HW-25EIT:G is typically available in a 84-ball BGA (Ball Grid Array) package. The pinout configuration includes:
- DQ: Data input/output pins for the memory array.
- DQS, DQS#: Data strobe pins for data input/output alignment.
- CLK: Clock input for synchronous operation.
- CS: Chip select for device activation.
- WE: Write enable to start a write operation.
- RAS, CAS, CKE: Control pins for row and column address strobe and clock enable.
- BA0-BA1: Bank select address pins.
- DM/DME: Data mask for write data or data mask for data input or output.
What are the Pros and Cons of MT47H32M16HW-25EIT:G?
Pros:
- High Data Transfer Rate: Offers high-speed data transfer for improved system performance.
- High Density: Provides a large memory capacity in a compact form factor.
- Synchronous Interface: Allows for precise data synchronization with the system controller.
- Low Power Consumption: Operates with low power, suitable for battery-powered devices.
Cons:
- Obsolete Technology: DDR2 SDRAM is an older memory technology, with newer alternatives available.
- Limited Availability: Due to the obsolescence, it might be challenging to procure in large quantities.
- Compatibility: May not be compatible with newer systems designed for DDR3 or DDR4 memory.
Are There Any Equivalents/Alternatives to MT47H32M16HW-25EIT:G for Recommendation?
- For a similar DDR2 SDRAM alternative, consider the H5TQ4G63AFR from SK hynix.
- Alternative memory technologies such as DDR3 or DDR4 SDRAM may be suitable for newer system designs.
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