H57V1262GTR-75C

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H57V1262GTR-75C is a synchronous dynamic random-access memory (SDRAM) chip manufactured by Hynix

  • Manufacturer Part # : H57V1262GTR-75C

  • Package/Case: TSOP54

  • Brand: HYNIX

  • Product Categories : Memory

Quality Assurance

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

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Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

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About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Service & Packaging

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

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H57V1262GTR-75C DataSheet

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Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H57V1262GTR-75C or email to us: Email: [email protected], we will contact you in 12 hours.

Details

H57V1262GTR-75C is a synchronous dynamic random-access memory (SDRAM) chip manufactured by Hynix. It offers 128Mb capacity, operates at a speed of 166MHz, and utilizes a 4-bank, 4K refresh architecture. The chip is organized in a 16Mx8 configuration and is designed for use in various electronic devices requiring high-speed memory.

Key Features

  • 16Mb (1M x 16) CMOS DRAM
  • Operating Voltage: 3.3V
  • High speed: 75ns
  • Low Voltage Operation
  • Industrial Temperature Range: -40°C to +85°C
  • Available in SOJ and TSOP packages

Application

  • Smartphones
  • Tablets
  • Laptops
  • Digital cameras
  • Portable media players
  • Automotive electronics
  • Home appliances
  • Medical devices
  • Gaming consoles
  • Industrial equipment

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Rohs Code Yes Part Life Cycle Code Obsolete
Part Package Code TSOP2 Pin Count ! 54
Reach Compliance Code ECCN Code EAR99
HTS Code ! 8542.32.00.02 Access Mode ! FOUR BANK PAGE BURST
Access Time-Max 5.4 ns Additional Feature ! AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz I/O Type COMMON
Interleaved Burst Length 1,2,4,8 JESD-30 Code R-PDSO-G54
JESD-609 Code e6 Length 22.238 mm
Memory Density 134217728 bit Memory IC Type SYNCHRONOUS DRAM
Memory Width 16 Number of Functions 1
Number of Ports ! 1 Number of Terminals 54
Number of Words 8388608 words Number of Words Code 8000000
Operating Mode ! SYNCHRONOUS Operating Temperature-Max 70 °C
Operating Temperature-Min Organization 8MX16
Output Characteristics 3-STATE Package Body Material PLASTIC/EPOXY
Package Code TSOP2 Package Equivalence Code TSOP54,.46,32
Package Shape RECTANGULAR Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260 Power Supplies ! 3.3 V
Qualification Status ! Not Qualified Refresh Cycles 4096
Seated Height-Max 1.194 mm Self Refresh YES
Sequential Burst Length 1,2,4,8,FP Standby Current-Max 0.002 A
Supply Current-Max 0.19 mA Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount ! YES Technology CMOS
Temperature Grade ! COMMERCIAL Terminal Finish Tin/Bismuth (Sn/Bi)
Terminal Form ! GULL WING Terminal Pitch ! 0.8 mm
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 20
Width 10.16 mm

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H57V1262GTR-75C PDF Download

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