H5GQ2H24AFR-R0C

Name: H5GQ2H24AFR-R0C
Rating: 4.5 (10 reviews)

2Gb (64Mx32) GDDR5 SGRAM

3,749 Effective Inventory

H5GQ2H24AFR-R0C

Effective Inventory3,749

2Gb (64Mx32) GDDR5 SGRAM

Manufacturer Part # : H5GQ2H24AFR-R0C
Package/Case: FBGA
Brand: HYNIX
Product Categories : DRAMs

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

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Paypal

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Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H5GQ2H24AFR-R0C DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5GQ2H24AFR-R0C or email to us: Email: [email protected], we will contact you in 12 hours.

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Details

Features · Plastic package has Underwriters Laboratory Flammability Classification 94V-0 · Low forward voltage drop · High current capability · High reliability · Low power loss, high effciency · High surge current capability · High speed switching · Low leakage

Key Features

· Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
· Low forward voltage drop
· High current capability
· High reliability
· Low power loss, high effciency
· High surge current capability
· High speed switching
· Low leakage

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Manufacturer

HYNIX

Product Category !

IC Chips

Datasheet PDF

Datasheets record the features, absolute maximum ratings, applications and more of the device, which benefit a lot as an overall guide to the specific application of the part.

Preliminary Specification H5GQ2H24AFR-R0C PDF Download

FAQs

What is H5GQ2H24AFR-R0C?

The H5GQ2H24AFR-R0C is a high-speed, low-power mobile DDR4 SDRAM (Synchronous Dynamic Random Access Memory) module manufactured by SK Hynix. It is designed for use in mobile devices such as smartphones, tablets, and portable gaming consoles, offering high performance and energy efficiency.

How Does H5GQ2H24AFR-R0C Work?

The H5GQ2H24AFR-R0C operates as a high-speed memory module for data storage and retrieval in mobile devices. It uses DDR4 technology to provide faster data transfer rates and lower power consumption compared to previous DRAM standards. The module is typically integrated into the device's memory subsystem to enhance overall performance.

How Many Pins does H5GQ2H24AFR-R0C have and What are the Functions of the Pinout Configuration?

The H5GQ2H24AFR-R0C typically comes in a fine pitch Ball Grid Array (BGA) package with a specified number of pins. The pinout configuration includes:

Data Pins: for transmitting and receiving data.
Address Pins: for specifying the memory location.
Control Pins: for managing read/write operations.
Power and Ground Pins: for supplying power to the module.

What are the Pros and Cons of H5GQ2H24AFR-R0C?

Pros:

High Speed: Offers fast data transfer rates, enhancing overall system performance.
Low Power Consumption: Designed for energy-efficient operation, extending battery life in mobile devices.
High Density: Provides ample storage capacity for multimedia and data-intensive applications.
Reliability: Manufactured by a reputable company known for quality memory products.
Compact Form Factor: Suitable for compact mobile device designs.

Cons:

Cost: Higher performance and features may result in a higher price point.
Complex Integration: Requires careful hardware and software integration for optimal performance.

Are There Any Equivalents/Alternatives to H5GQ2H24AFR-R0C for Recommendation?

Some equivalents or alternatives to the H5GQ2H24AFR-R0C mobile DDR4 SDRAM module include products from other memory manufacturers such as Samsung, Micron, and Toshiba. It is recommended to compare specifications, compatibility, and pricing when selecting an alternative module for a specific mobile device application.