H5GQ1H24BFR-T2C

Name: H5GQ1H24BFR-T2C
Rating: 4.5 (10 reviews)

4,650 Effective Inventory

H5GQ1H24BFR-T2C

Effective Inventory4,650

Manufacturer Part # : H5GQ1H24BFR-T2C
Package/Case: BGA170
Brand: HYNIX
Product Categories : DRAMs

Quality Assurance

All parts procured from our supply chain network undergo a rigorous incoming inspection process. This meticulous inspection ensures that the parts received by our customers are authentic and meet the required standards. Additionally, we maintain detailed records of these inspections to ensure transparency and traceability throughout the supply chain.

Certification

We have successfully obtained various certification standards and have established our own professional testing laboratory. This ensures that every product we supply to our customers meets the highest quality standards. We adhere to strict testing protocols to maintain the consistency and accuracy of our products. To ensure that our products are original and genuine, we also collaborate with reputable third-party testing facilities to conduct rigorous quality testing. Our commitment to quality extends to meeting industry, legal, regulatory, and ISO 9001:2015 requirements.

Shipping & Payment

About Shipping

We generally ship orders within a few business days through reliable shipping carriers such as FedEx, SF, UPS, or DHL. We also have support for other shipping methods. If you would like to inquire about specific shipping details or costs, please don't hesitate to reach out to us.

About Payment

We accept various payment methods, including VISA, MasterCard, UnionPay, Western Union, PayPal, and other channels.

If you have a specific payment method in mind or would like to inquire about rates and other details, please feel free to contact us.

WireTransfer

Paypal

CreditCard

WesternUnion

MoneyGram

Service & Packaging

About After Sales Service

All Parts Extended Quality Guarantee

Initiate the application within 90 days from the shipment date.

Confirm the return or exchange with our staff.

Maintain the goods in their original condition as received.

Lastly, please note that the eligibility for return or exchange of goods is subject to an assessment of the actual condition of the returned items. We will evaluate the received goods before finalizing the return or exchange process. If you have any inquiries or require further assistance regarding returns or exchanges, please don't hesitate to contact us at [email protected]

About packaging

Regarding packaging, our products are carefully packed in anti-static bags to provide ESD anti-static protection. The outer packaging is durable with secure closure. We support various packaging methods such as Tape and Reel, Cut Tape, Tube, or Tray.

Example

Tape and Reel

Cut Tape

Tube or Tray

H5GQ1H24BFR-T2C DataSheet

Current price plan is under preparation. Please contact our customer service team for the latest pricing information. Thank you for your understanding and support!

Rapid Quote

Please submit RFQ for H5GQ1H24BFR-T2C or email to us: Email: [email protected], we will contact you in 12 hours.

Quantity^*

Contact Person^*

E-mail^*

Company Name

Anything else?

Details

Features · Plastic package has Underwriters Laboratory Flammability Classification 94V-0 · Low forward voltage drop · High current capability · High reliability · Low power loss, high effciency · High surge current capability · High speed switching · Low leakage

Key Features

· Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
· Low forward voltage drop
· High current capability
· High reliability
· Low power loss, high effciency
· High surge current capability
· High speed switching
· Low leakage

Specifications

The followings are basic parameters of the part selected concerning the characteristics of the part and categories it belongs to.

Manufacturer

HYNIX

Product Category !

IC Chips

FAQs

What is H5GQ1H24BFR-T2C?

The H5GQ1H24BFR-T2C is a high-speed and high-density mobile DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) module manufactured by SK Hynix. It is designed for use in mobile devices such as smartphones, tablets, and laptops to provide fast and efficient memory storage and access.

How Does H5GQ1H24BFR-T2C Work?

The H5GQ1H24BFR-T2C works by storing and retrieving data in a synchronized manner with the device's processor. It operates at high speeds and low power consumption, making it suitable for mobile applications. The DDR3 technology allows for faster data transfer rates compared to older memory standards, enhancing overall device performance.

How Many Pins does H5GQ1H24BFR-T2C have and What are the Functions of the Pinout Configuration?

The H5GQ1H24BFR-T2C comes in a small form-factor BGA (Ball Grid Array) package with a specific pinout for connection to the device:

Data Pins: Responsible for bi-directional data transfer between the memory module and the device.
Address Pins: Used to identify memory locations for data storage and retrieval.
Control Pins: Manage the flow of data and commands between the memory module and the device.
Power Pins: Provide the necessary power supply to the memory module for operation.
Clock Pins: Synchronize data transfer between the memory module and the device processor.

What are the Pros and Cons of H5GQ1H24BFR-T2C?

Pros:

High Speed: Offers fast data transfer rates, improving overall system performance.
High Density: Provides a large memory capacity in a compact form factor.
Low Power Consumption: Operates efficiently to conserve battery life in mobile devices.
Reliable: Manufactured by SK Hynix, known for producing quality memory products.

Cons:

Cost: High-speed and high-density memory modules like the H5GQ1H24BFR-T2C may come at a premium price.
Compatibility: Requires devices that support DDR3 SDRAM technology to function properly.
Complexity: Installation and integration may require technical expertise for optimal performance.